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| Content Provider | The American Society of Mechanical Engineers (ASME) Digital Collection |
|---|---|
| Author | Lin, Vincent Chen, Sih-Li |
| Copyright Year | 2003 |
| Abstract | This paper develops an analytical model to predict the overall thermal resistance of a parallel plate heat sink associated with a non-uniform heat source. Using constrictive ratio and apparent interface ratio to interpret equivalent heat source area and maximal heat flux on source-to-sink contacting surface, the non-uniform heat source problem can be simplified as an equivalent uniform heat source problem. Then by using the existed correlations the present model can calculate the overall thermal resistance as a function of heat sink geometry, properties, interface conditions, and airflow velocity. An experimental investigation is performed to verify the theoretical model. Prediction results show good agreement with experimental measurements over a number of testing units. A case study of optimum is also proposed to demonstrate and understand the effects of variable constrictive ratio and apparent interface resistance. |
| Sponsorship | Electronic and Photonic Packaging Division |
| Starting Page | 229 |
| Ending Page | 236 |
| Page Count | 8 |
| File Format | |
| ISBN | 0791836908 |
| DOI | 10.1115/IPACK2003-35103 |
| e-ISBN | 0791836746 |
| Volume Number | 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2 |
| Conference Proceedings | ASME 2003 International Electronic Packaging Technical Conference and Exhibition |
| Language | English |
| Publisher Date | 2003-07-06 |
| Publisher Place | Maui, Hawaii, USA |
| Access Restriction | Subscribed |
| Subject Keyword | Geometry Heat Air flow Thermal resistance Heat sinks Heat flux Testing |
| Content Type | Text |
| Resource Type | Article |
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