NDLI: Thermal Analysis of Natural Convection Cooled Switch Mode Power Supplies

Content Provider	The American Society of Mechanical Engineers (ASME) Digital Collection
Author	Koizumi, Katsuhiro Joboji, Akito Nagahara, Kuniaki Ishizuka, Masaru
Copyright Year	2003
Abstract	This paper describes an application example of thermal flow simulation to the design of a switch mode power supply (SMPS) that is natural convection air-cooled. In this analysis, the modeling of printed circuit board (PCB) and power semiconductor devices was examined using the design of experiments method. The PCB was treated as a simple plate, and average thermal conductivity was not considered. The power semiconductor devices were modeled as a simple hexahedral resistive network block. As the heat generation sources, a field effect transistor (FET) and a diode were considered in the simulation, and the calculation method of power loss is described. The difference between measured and calculated values for power semiconductor devices was found to be within approximately 10 K.
Sponsorship	Electronic and Photonic Packaging Division
Starting Page	103
Ending Page	109
Page Count	7
File Format	PDF
ISBN	0791836908
DOI	10.1115/IPACK2003-35048
e-ISBN	0791836746
Volume Number	2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2
Conference Proceedings	ASME 2003 International Electronic Packaging Technical Conference and Exhibition
Language	English
Publisher Date	2003-07-06
Publisher Place	Maui, Hawaii, USA
Access Restriction	Subscribed
Subject Keyword	Computational methods Switches Natural convection Modeling Design Flow simulation Heat Printed circuit boards Simulation Experimental design Thermal conductivity Thermal analysis Power semiconductor devices Transistors
Content Type	Text
Resource Type	Article

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