NDLI: Numerical Analysis on Cooling Performance for FET Heat Sink

Content Provider	The American Society of Mechanical Engineers (ASME) Digital Collection
Author	Jang, Kyung Min Kim, Jun Young Eum, Cholongi Kim, Kwangsun
Copyright Year	2014
Abstract	With the improved performance of IT devices like car microprocessors, the heat generated in the electric devices are being increased in amount. The increased heating value degrades the performance of devices and circuits, which will affect the durability and reliability of products eventually by causing their failure. Therefore, a study on the cooling performance improvement of heat sinks is essential to decrease the temperatures of the field effect transistors (FETs) in cars. In this study, numerical analysis and experimental tests were carried out to develop a new heat sink design for a different FET material, heat conductive resin. Without the heat sink, the new FET had a temperature distribution of 70–90 Celsius, which was measured in the laboratory environment similar to the real chamber within a car. Based on the numerical and experimental test and analysis of the FET new heat sink system, the improved shape and array of the fins are developed that meet the target temperature of the FET. For heat sinks, efficient cooling design and reduced manufacturing costs are derived from the comparison with those of old heat sink material, Aluminum.
File Format	PDF
ISBN	9780791849569
DOI	10.1115/IMECE2014-39220
Volume Number	Volume 8B: Heat Transfer and Thermal Engineering
Conference Proceedings	ASME 2014 International Mechanical Engineering Congress and Exposition
Language	English
Publisher Date	2014-11-14
Publisher Place	Montreal, Quebec, Canada
Access Restriction	Subscribed
Subject Keyword	Temperature distribution Temperature Cooling Aluminum Circuits Durability Fins Automobiles Design Heat Numerical analysis Heating Manufacturing Shapes Resins Transistors Heat sinks Product reliability Failure
Content Type	Text
Resource Type	Article

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