NDLI: High Pressure Pool Boiling on a Hydrophobic Surface

Content Provider	The American Society of Mechanical Engineers (ASME) Digital Collection
Author	Li, Nanxi Betz, Amy Rachel
Copyright Year	2014
Abstract	The purpose of this research is to investigate heat transfer enhancement on a Teflon© coated hydrophobic surface compared to a plain copper surface at increased pressures with deionized water. Previous research has shown that hydrophobic surfaces promote bubble nucleation and increase heat transfer coefficient. However, heat transfer enhancement on hydrophobic surfaces at high pressures is not widely studied. To carry out the experiments, we designed and fabricated a special experimental facility that will withstand the high pressures (up to 20 bar/ 290 psi) and high temperatures (270 °C /518 °F). A copper surface is coated with Telfon© AF solution using dip coating. Boiling tests are done on a plain copper surface and the Teflon© coated hydrophobic surface at elevated pressures. Test results show that both high pressure and hydrophobic coating will enhance the boiling performance. Bubble nucleation on the hydrophobic surface starts at lower heat fluxes. The effect of pressure on the Teflon© coated surface is smaller compared to the plain copper surface. Approximately 40% of increase of heat transfer coefficient is observed for the Teflon© coated copper surface at 15 psig.
File Format	PDF
ISBN	9780791849569
DOI	10.1115/IMECE2014-38250
Volume Number	Volume 8B: Heat Transfer and Thermal Engineering
Conference Proceedings	ASME 2014 International Mechanical Engineering Congress and Exposition
Language	English
Publisher Date	2014-11-14
Publisher Place	Montreal, Quebec, Canada
Access Restriction	Subscribed
Subject Keyword	Water High temperature Coatings Boiling Pressure Nucleation (physics) High pressure (physics) Bubbles Heat Flux (metallurgy) Coating processes Copper Heat transfer coefficients Pool boiling Heat transfer
Content Type	Text
Resource Type	Article

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