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| Content Provider | The American Society of Mechanical Engineers (ASME) Digital Collection |
|---|---|
| Author | Goda, Yasuhiro Sawa, Toshiyuki Himuro, Katsuya Yamamoto, Ken-Ichi |
| Copyright Year | 2010 |
| Abstract | The effects of environmental degradations on the deformation behavior of an epoxy resin for structural adhesive are experimentally examined using an INSTRON-type material testing machine. The effects of environmental degradations on the shear strength of adhesive joints are also examined using an INSTRON-type material testing machine and a split Hopkinson pressure bar apparatus. The results of quasi-static tensile tests for an epoxy resin for structural adhesive shows that the effect of the resistant to heat degradations tests is small on the deformation behavior, while it seems that the yield stress decreases and the elongation after the rupture increases as the degradations day increases in the resistant to moisture degradation tests. The results of quasi-static and impact shear tests for the adhesive joints shows that the effect of the resistant to heat degradations tests is small on the joint strength, while the shear strength decreases as the degradations day increases at any strain rate in the resistant to moisture degradation tests. In addition, the stress distributions at the adhesive interface of adhesive joints are examined using finite element stress analysis. From the numerical results, it is assumed that the joint strength increases as Young’s modulus of the adhesive decreases and the adhesive thickness is 0.25 mm. For verification of the FEA, the loading responses between the experimental and the numerical results are compared. A fairly good agreement is found between the experimental and the numerical results. |
| Starting Page | 29 |
| Ending Page | 36 |
| Page Count | 8 |
| File Format | |
| ISBN | 9780791844465 |
| DOI | 10.1115/IMECE2010-38383 |
| Volume Number | Volume 9: Mechanics of Solids, Structures and Fluids |
| Conference Proceedings | ASME 2010 International Mechanical Engineering Congress and Exposition |
| Language | English |
| Publisher Date | 2010-11-12 |
| Publisher Place | Vancouver, British Columbia, Canada |
| Access Restriction | Subscribed |
| Subject Keyword | Materials testing Deformation Rupture Stress analysis (engineering) Shear strength Machinery Pressure Stress Young's modulus Heat Adhesives Impact strength Epoxy resins Adhesive joints Finite element analysis Shear (mechanics) Yield stress Elongation |
| Content Type | Text |
| Resource Type | Article |
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