NDLI: Development and Testing of a Prototype Heat Sink Within a Wind Tunnel for Use in an Engineering Course

Content Provider	The American Society of Mechanical Engineers (ASME) Digital Collection
Author	Margarita, L. Cortez Jokar, Amir
Copyright Year	2009
Abstract	The purpose of this undergraduate research project was to develop a test section and prototype heat sinks that will be used in an existing electronics cooling wind tunnel for a project in a future Advanced Thermal Systems course. During the course, students will design and manufacture their own prototype heat sinks. Heat sinks are made of highly conductive materials with various geometries and are attached to computer chips to dissipate heat from them to the surroundings. The prototype heat sinks will be manufactured in the school’s facilities which will limit the complexity of the geometry. The purpose is not to design a commercial heat sink. The students will experimentally analyze and simulate the heat transfer that takes place between a computer chip and a heat sink. During the course project the students will also analyze the heat sinks using CFD and compare the results to the experimental data. In this study, an electronics cooling wind tunnel was used to simulate the flow conditions that normally exist in a personal computer. A test section was designed and built in order to measure temperatures at different locations on a prototype heat sink using 18 type-T thermocouples. A data acquisition unit was set up and a Labview program was developed to collect the temperature data as well as the air velocity of the wind tunnel. The recorded data were then transferred to an excel file for further analysis. The objectives of this summer internship project were achieved through testing and analyzing different prototype heat sinks.
Starting Page	983
Ending Page	989
Page Count	7
File Format	PDF
ISBN	9780791843826
DOI	10.1115/IMECE2009-12084
e-ISBN	9780791838631
Volume Number	Volume 9: Heat Transfer, Fluid Flows, and Thermal Systems, Parts A, B and C
Conference Proceedings	ASME 2009 International Mechanical Engineering Congress and Exposition
Language	English
Publisher Date	2009-11-13
Publisher Place	Lake Buena Vista, Florida, USA
Access Restriction	Subscribed
Subject Keyword	Computers Temperature Wind tunnels Computational fluid dynamics Data acquisition Thermocouples Computer cooling Thermal systems Engineering education Flow (dynamics) Design Integrated circuits Geometry Heat Undergraduate research Students Internships Engineering prototypes Heat sinks Heat transfer Testing
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

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