NDLI: Distributed Control to Improve Performance of Thermoelectric Coolers

Content Provider	The American Society of Mechanical Engineers (ASME) Digital Collection
Author	Harvey, R. D. Walker, D. G. Frampton, K. D.
Copyright Year	2004
Abstract	Thermoelectric coolers (TECs) have become potential solutions for chip cooling applications. However, the scope of TEC applicability is limited because of poor efficiency that is largely governed by material properties. This low efficiency causes increased heat production resulting in a very narrow band in which the TEC is effective. Since TECs are cooling units composed of numerous individual cooling elements, or thermocouples, the operating efficiency can be improved by implementing distributed control of the individual couples. Distributed control is a system for allowing each couple to be powered depending on the localized heat load. Distributed control would allow for increased cooling in hot spots while minimizing excess heat generated by the TEC in areas where it is not needed. The preliminary results suggest that this type of control may be feasible, and would result in a significant increase in the TEC effectiveness. The current model considers lateral heat conduction in the chip, as well as variable control of the individual thermocouples proportional to heat load. Results indicate that a 2-fold increase in COP is possible with independently controlled couples compared to a single cooler.
Sponsorship	Heat Transfer Division
Starting Page	197
Ending Page	201
Page Count	5
File Format	PDF
ISBN	079184711X
DOI	10.1115/IMECE2004-59859
Volume Number	Heat Transfer, Volume 2
Conference Proceedings	ASME 2004 International Mechanical Engineering Congress and Exposition
Language	English
Publisher Date	2004-11-13
Publisher Place	Anaheim, California, USA
Access Restriction	Subscribed
Subject Keyword	Thermoelectric Cooler Distributed Thermocouple Heat conduction Heat Cooling Thermocouples Materials properties Thermoelectric coolers Stress
Content Type	Text
Resource Type	Article

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