NDLI: Study of the Hot Spots in Integrated Circuits Cooled by Microfluidic Heatsinks

Content Provider	The American Society of Mechanical Engineers (ASME) Digital Collection
Author	Motieifar, Alireza Shafai, Cyrus Hassan, M. Soliman
Copyright Year	2007
Abstract	The thermal input into high-power Integrated Circuits (IC) can have local peaks or hot spots with heat fluxes far exceeding 100 W/cm2. In this work, the temperature distribution on a microfluidic heatsink has been simulated using the FEM method. The effects of the fluid flow and thickness of the heatsink on the hot spot temperature have been studied. Simulations have been performed for a 1 cm × 1 cm heat sink loaded with 100 W/cm2 heating power, with a 1 mm hot spot of 1000 W/cm2 and a 3 mm hot spot of 500 W/cm2. Heat sinks fabricated from silicon, nickel, and copper are considered. These results show that the effect of increasing the thickness of the heatsink on the peak temperature of the hot spot depends on the solid material and the fluid flow. Simulations showed that the hot spot temperature rise can be about 40% higher if a nickel heat sink is used instead of a copper heat sink.
Sponsorship	Nanotechnology Institute
Starting Page	293
Ending Page	298
Page Count	6
File Format	PDF
ISBN	079184272X
DOI	10.1115/ICNMM2007-30195
e-ISBN	0791838005
Volume Number	ASME 5th International Conference on Nanochannels, Microchannels, and Minichannels
Conference Proceedings	ASME 2007 5th International Conference on Nanochannels, Microchannels, and Minichannels
Language	English
Publisher Date	2007-06-18
Publisher Place	Puebla, Mexico
Access Restriction	Subscribed
Subject Keyword	Temperature distribution Temperature Fluid dynamics Finite element methods Integrated circuits Finite element model Heat Simulation Heating Flux (metallurgy) Nickel Silicon Engineering simulation Copper Heat sinks Microfluidics
Content Type	Text
Resource Type	Article

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