NDLI: Comparative Analysis of Microchannel Cooling Schemes Subject to a Pressure Constraint

Content Provider	The American Society of Mechanical Engineers (ASME) Digital Collection
Author	Farnam, Dylan Sammakia, Bahgat Ackler, Harold Ghose, Kanad
Copyright Year	2007
Abstract	Leakage losses and overall increased power dissipation in the microprocessor are causing significant thermal, mechanical, and reliability problems. Aside from the issue of cooling chip hot spots in order to reduce stress-inducing thermal gradients, the traditional challenge of quelling overall operating temperatures remains. Conventional cooling methods are reaching their practical limits and new methods of lowering the operating temperature of microprocessors are being explored. Microfluidics-based cooling schemes are one approach being considered. Implementation of microchannels for forced convection at the chip level shows much promise, as the effective heat transfer surface area and attainable heat transfer coefficient are very favorable. A major design limitation to such an implementation is the pressure developed with such micro-flows, and the stresses that could result. In this study, multiple discrete microchannel configurations are analyzed computationally and compared in a cooling capability optimization sense, while total pressure drop across the flows is carefully considered. A single cooling channel over an energy source is split into two smaller channels, and so on, while total pressure drop is maintained constant, and specified such that all flows remain in the laminar regime. It is shown that for the configurations analyzed, there exists a definitive optimum cooling scheme. In addition, the effects of variation of channel height for the initially-determined optimum scheme are studied. It is shown that a slimmer design may be implemented with very little effect on cooling capability.
Sponsorship	Nanotechnology Institute
Starting Page	277
Ending Page	284
Page Count	8
File Format	PDF
ISBN	079184272X
DOI	10.1115/ICNMM2007-30187
e-ISBN	0791838005
Volume Number	ASME 5th International Conference on Nanochannels, Microchannels, and Minichannels
Conference Proceedings	ASME 2007 5th International Conference on Nanochannels, Microchannels, and Minichannels
Language	English
Publisher Date	2007-06-18
Publisher Place	Puebla, Mexico
Access Restriction	Subscribed
Subject Keyword	Leakage Forced convection Cooling Pressure Flow (dynamics) Stress Optimization Microchannels Temperature gradient Design Energy resources Pressure drop Energy dissipation Reliability Heat transfer coefficients Heat transfer Microfluidics Operating temperature
Content Type	Text
Resource Type	Article

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