NDLI: Experimental Investigation of Thermal Management of Tablet Computers Using Phase Change Materials (PCMs)

Content Provider	The American Society of Mechanical Engineers (ASME) Digital Collection
Author	Ahmed, Tousif Bhouri, Maha Kahwaji, Samer Groulx, Dominic White, Mary Anne
Copyright Year	2016
Abstract	This paper presents a study of thermal management of tablet computers (tablet PCs) using phase change materials (PCMs) encapsulated in aluminized laminated film under continuous operation. The experimental setup consists of original tablet PC parts and a simplified dummy printed circuit board (PCB) with a thermal response similar to the original PCB. Two PCMs were used in the experiments, n-eicosane and PT-37 (a commercial PCM from PureTemp). These PCMs have similar melting temperatures (n-eicosane – 35.6 °C; PT-37 – 36.3 °C) but different latent heats of fusion (n-eicosane – 236 kJ/kg; PT-37 – 206 kJ/kg). Two encapsulations with different sizes (6″ × 2.6″, 7″ × 1.5″) but the same thickness (0.0792″ (2 mm)) were used in this study. The effects of inclination and power input level on the thermal behavior of the tablet were investigated. Experiments showed that PCM encapsulated in laminate film led to lower back cover temperature for constant heat flux applications. As much as a 20 °C temperature reduction of the back cover hotspot was achieved with encapsulated PCM. It was also observed that better thermal behavior was achieved both by the melting of PCMs and heat spreading through the laminate film. It was found that the rate of PCM melting is directly related to the power input. No significant effect on PCM melting and temperature history was observed in relation to the system inclination.
Sponsorship	Heat Transfer Division
File Format	PDF
ISBN	9780791850336
DOI	10.1115/HT2016-7067
Volume Number	Volume 2: Heat Transfer in Multiphase Systems; Gas Turbine Heat Transfer; Manufacturing and Materials Processing; Heat Transfer in Electronic Equipment; Heat and Mass Transfer in Biotechnology; Heat Transfer Under Extreme Conditions; Computational Heat Transfer; Heat Transfer Visualization Gallery; General Papers on Heat Transfer; Multiphase Flow and Heat Transfer; Transport Phenomena in Manufacturing and Materials Processing
Conference Proceedings	ASME 2016 Heat Transfer Summer Conference collocated with the ASME 2016 Fluids Engineering Division Summer Meeting and the ASME 2016 14th International Conference on Nanochannels, Microchannels, and Minichannels
Language	English
Publisher Date	2016-07-10
Publisher Place	Washington, DC, USA
Access Restriction	Subscribed
Subject Keyword	Computers Phase change materials Temperature Heat Melting Printed circuit boards Dynamic light scattering Thermal management Laminates Heat flux
Content Type	Text
Resource Type	Article

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