NDLI: A routing fabric for monolithically stacked 3D-FPGA

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A routing fabric for monolithically stacked 3D-FPGA

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A routing fabric for monolithically stacked 3D-FPGA

Content Provider	ACM Digital Library
Author	Lin, Mingjie El Gamal, Abbas
Abstract	A previous study on the benefits of monolithically stacked 3D-FPGA has estimated a 3.2x improvement in logic density, a 1.7x improvement in delay, and a 1.7x improvement in dynamic power consumption over a baseline 2D-FPGA with no change in architecture. This paper describes a new routing fabric and shows that a 3D-FPGA using this fabric can achieve a 3.3x improvement in logic density, a 2.35x improvement in delay, and a 2.82x improvement in dynamic power consumption over the same baseline 2D-FPGA. The additional improvements in delay and power consumption are achieved by reducing net loading in several ways: (i) Only Single and Double interconnect segments are used. This reduces the total interconnect length used to implement each net. (ii) The routing fabric is hierarchical. Each logic block's inputs and outputs connect first to local segments. These segments can be then programmably connected to local segments in neighboring routing blocks via programmable buffers and/or to interconnect segments in routing channels via muxes with buffered outputs. (iii) Interconnect segments can be directly connected to form longer segments using programmable buffers without going through routing blocks. (iv) The routing block provides switching capability beyond that of a conventional switch box. A 3D-FPGA using this new routing fabric can be realized by stacking two configuration memory layers and a switch layer on top of a standard CMOS layer with a total of 12 metal layers interspersed between them. A CAD flow based on VPR with appropriate modifications to the routing graph generation and routing algorithm is developed and used in the performance analysis.
Starting Page	3
Ending Page	12
Page Count	10
File Format	PDF
ISBN	9781595936004
DOI	10.1145/1216919.1216921
Language	English
Publisher	Association for Computing Machinery (ACM)
Publisher Date	2007-02-18
Publisher Place	New York
Access Restriction	Subscribed
Subject Keyword	Fpga 3d monolithically stacked Performance analysis Routing architecture
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

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