NDLI: A global routing method for 2-layer ball grid array packages

Content Provider	ACM Digital Library
Author	Takahashi, Atsushi Kubo, Yukiko
Abstract	In current VLSI circuits, there can be hundreds of required I/O pins. BGA(Ball Grid Array) packaging is commonly used to realize the huge number of connections between VLSI and PCB. In this paper, we propose a global routing method for two-layer BGA packages. In our routing model, the global routing for each net is uniquely determined by a via assignment. Our global routing method begins with an initial feasible via assignment and incrementally improves the via assignment to minimize the total wire length and wire congestion. In each iteration, a via assignment is improved by exchanging adjacent two vias, rotating three vias, or by moving vias to their adjacent grids one by one. Our method is a greedy-based heuristic. The algorithm efficiently generates better global routes than initial routes with respect to wire congestion and total wire length.
Starting Page	36
Ending Page	43
Page Count	8
File Format	PDF
ISBN	1595930213
DOI	10.1145/1055137.1055146
Language	English
Publisher	Association for Computing Machinery (ACM)
Publisher Date	2005-04-03
Publisher Place	New York
Access Restriction	Subscribed
Subject Keyword	Ball grid array Cost graph Global routing 2-layer routing Monotonic Greedy Heuristic
Content Type	Text
Resource Type	Article

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A global routing method for 2-layer ball grid array packages