NDLI: Alteration of cell-wall composition ofFusarium oxysporum by copper stress

Content Provider	Springer Nature Link
Author	Hefnawy, M. A. Razab, A. A.
Copyright Year	1998
Abstract	A strain ofFusarium oxysporum tolerated copper in the growth medium at concentrations up to 600 mg/L. The optimum growth was obtained at 200 mg Cu/L. The mycelium acquired a blue color in the presence of copper. The copper content of isolated cell walls obtained from mycelium grown in the presence of 600 mg Cu/L was 1.5 times higher than that of cell walls obtained from mycelium grown at 200 mg Cu/L and it contained 2.2 and 3.3% copper at 200 and 600 mg Cu/L, respectively. The amount of protein and total sugars increased in both the mycelium and its isolated cell walls in the presence of copper in the growth medium, chitin was also increased in the cell wall, reaching its maximum amount at 200 mg Cu/L— about 2.4 times higher than without copper. Most of amino acid concentrations in the cell wall were increased in the presence of 200 mg Cu/L and decreased above this concentration. Isoleucine, leucine, tyrosine, phenylalanine, and arginine showed the highest increase at this concentration. The altered cell walls obtained from mycelium grown at 200 and 400 mg Cu/L could rebind individual metals more than the control cell walls could. Rebinding of individual metals was in the order Zn>Fe>Ni>Cu>Co. Rebinding of copper by isolated cell walls depended on pH and temperature.
Starting Page	453
Ending Page	458
Page Count	6
File Format	PDF
ISSN	00155632
Journal	Folia Microbiologica
Volume Number	43
Issue Number	5
e-ISSN	18749356
Language	English
Publisher	Springer Netherlands
Publisher Date	1998-01-01
Publisher Place	Dordrecht
Access Restriction	One Nation One Subscription (ONOS)
Subject Keyword	Life Sciences Microbiology Applied Microbiology Immunology Environmental Engineering/Biotechnology
Content Type	Text
Resource Type	Article
Subject	Medicine Microbiology

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