NDLI: Thermal analysis of high power LEDs on the MCPCB

Content Provider	Springer Nature Link
Author	Kim, In Cho, Sungeun Jung, Dogyun Lee, Cheul Ro Kim, Daesuk Baek, Byung Joon
Copyright Year	2013
Abstract	The management of the reduced junction temperature of LEDs is a critical issue because it will affect many physical parameters such as light output, wave length and LED’s lifetime. The model used in this simulation consists of a metal core PCB attached with six chips(GaN on sapphire, Ag paste, cathode/anode, silicone encapsulant, mold frame) for 5W LED module. The MCPCB is composed of an aluminum base plate, a thin layer of dielectric, and a layer of copper. The temperature distribution of the developed LED module was simulated, and the thermal behavior within this 3-D model was investigated by using a commercial computational fluid dynamic code (Fluent 6.3). The results showed that the temperature variation along the vertical direction is more dominant than that in the circumferential direction due to the heat spreading effect of the copper layer. The ratio of heat dissipation through the each thermal path was calculated and compared for various input conditions. Several parameters that increase the junction temperature, such as the thermal conductivity and thickness of the dielectric layer and the encapsulate material, heat transfer coefficient and input power were also examined. Finally, a combination of designs for attenuating the junction temperature was proposed.
Starting Page	1493
Ending Page	1499
Page Count	7
File Format	PDF
ISSN	1738494X
Journal	Journal of Mechanical Science and Technology
Volume Number	27
Issue Number	5
e-ISSN	19763824
Language	English
Publisher	Korean Society of Mechanical Engineers
Publisher Date	2013-05-23
Publisher Place	Heidelberg
Access Restriction	One Nation One Subscription (ONOS)
Subject Keyword	Thermal analysis Light emitting diodes (LEDs) Metal core PCB Dielectric layer Encapsulation material Mechanical Engineering Vibration, Dynamical Systems, Control Industrial and Production Engineering
Content Type	Text
Resource Type	Article
Subject	Mechanics of Materials Mechanical Engineering

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