NDLI: Relationship Between Mechanical Properties of Lead-Free Solders and Their Heat Treatment Parameters

Content Provider	Springer Nature Link
Author	Klasik, A. Sobczak, N. Pietrzak, K. Makowska, K. Wojciechowski, A. Kudyba, A. Sienicki, E.
Copyright Year	2012
Abstract	The research was undertaken to establish mechanical properties of as-cast and heat-treated Sn-Zn-based alloys of binary and ternary systems as candidates for lead (Pb)-free solder materials for high-temperature applications. The heat treatment of as-cast alloys was made under different combinations of processing parameters (168 h/50 °C, 42 h/80 °C, and 24 h/110 °C). The systematic study of structure-property relationships in Sn-Zn, Sn-Zn-Ag, and Sn-Zn-Cu alloys containing the same amount of Zn (4.5, 9, 13.5 wt.%) and 1 wt.% of either Ag or Cu was conducted to identify the effects of chemical composition and heat treatment processing parameters on the alloy microstructure and mechanical behavior. Structural characterization was made using optical microscopy and scanning electron microscopy techniques coupled with EDS analysis. Mechanical properties (initial Young’s modulus E, ultimate tensile strength UTS, elastic limit R $_{0.05}$, yield point R $_{0.2}$, elongation A $_{5}$, and necking Z) were determined by means of static tensile tests. All the examined Sn-Zn-based alloys have attractive combination of mechanical characteristics, especially tensile strength, having values higher than that of common leaded solders and their substitutes of Pb-free SAC family. The results obtained demonstrate that the Sn-Zn-based alloys present competitive Pb-free solder candidates for high-temperature applications.
Starting Page	620
Ending Page	628
Page Count	9
File Format	PDF
ISSN	10599495
Journal	Journal of Materials Engineering and Performance
Volume Number	21
Issue Number	5
e-ISSN	15441024
Language	English
Publisher	Springer US
Publisher Date	2012-01-25
Publisher Place	Boston
Access Restriction	One Nation One Subscription (ONOS)
Subject Keyword	mechanical tests microstructure Pb-free Sn-Zn Sn-Zn-Ag Sn-Zn-Cu Quality Control, Reliability, Safety and Risk Characterization and Evaluation of Materials Tribology, Corrosion and Coatings Engineering Design
Content Type	Text
Resource Type	Article
Subject	Mechanics of Materials Materials Science Mechanical Engineering

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Relationship Between Mechanical Properties of Lead-Free Solders and Their Heat Treatment Parameters

Structural Aspects of the Behavior of Lead-Free Solder in the Corrosive Solution

Wetting and Microstructure Evolution of the Sn-Zn-Ag/Cu Interface

Effect of pH of Sulfate Solution on Electrochemical Behavior of Pb-Free Solder Candidates of SnZn and SnZnCu Systems

Structural Aspects of the Behavior of Lead-Free Solder in the Corrosive Solution

Joint strength and interfacial microstructure between Sn–Ag–Cu and Sn–Zn–Bi solders and Cu substrate

Erratum to: Wetting and Microstructure Evolution of the Sn-Zn-Ag/Cu Interface

Effect of Ag on Sn–Cu and Sn–Zn lead free solders

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Relationship Between Mechanical Properties of Lead-Free Solders and Their Heat Treatment Parameters

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