NDLI: Wetting of Cu and Al by Sn-Zn and Zn-Al Eutectic Alloys

Content Provider	Springer Nature Link
Author	Pstruś, Janusz Fima, Przemysław Gancarz, Tomasz
Copyright Year	2012
Abstract	Wetting properties of Sn-Zn and Zn-Al alloys on Cu and Al substrates were studied. Spreading tests were carried out for 3 min, in air and under protective atmosphere of nitrogen, with the use of fluxes. In the case of Zn-Al eutectic, spreading tests were carried out at 460, 480, 500, and 520 °C, and in the case of Sn-Zn eutectic at 250, 300, 350, 400, 450, and 500 °C, respectively. Solidified solder/substrate couples were cross-sectioned and subjected to microstructure examination. The spreading tests indicated that the wetting properties of eutectic Sn-Zn alloys, on copper pads do not depend on temperature (up to 400 °C), but in the lack of protective atmosphere, the solder does not wet the pads. Wettability studies of Zn-Al eutectic on aluminum and copper substrates have shown a negative effect of the protective nitrogen atmosphere on the wetting properties, especially for the copper pads. Furthermore, it was noted that with increasing temperature the solder wettability is improved. In addition, densities of liquid solders were studied by means of dilatometric technique.
Starting Page	606
Ending Page	613
Page Count	8
File Format	PDF
ISSN	10599495
Journal	Journal of Materials Engineering and Performance
Volume Number	21
Issue Number	5
e-ISSN	15441024
Language	English
Publisher	Springer US
Publisher Date	2012-03-09
Publisher Place	Boston
Access Restriction	One Nation One Subscription (ONOS)
Subject Keyword	electronic materials microstructure Sn-Zn wetting Zn-Al Quality Control, Reliability, Safety and Risk Characterization and Evaluation of Materials Tribology, Corrosion and Coatings Engineering Design
Content Type	Text
Resource Type	Article
Subject	Mechanics of Materials Materials Science Mechanical Engineering

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