NDLI: Methodology for Analyzing Slip Behavior in Ball Grid Array Lead-Free Solder Joints After Simple Shear

Content Provider	Springer Nature Link
Author	Zhou, Bite Bieler, Thomas R. Lee, Tae Kyu Liu, Kuo Chuan
Copyright Year	2009
Abstract	To examine how a lead-free solder joint deforms requires understanding of both the elastic and plastic stress and strain behavior. While elastic properties are extremely anisotropic, as discussed in a companion paper, plastic response is also anisotropic, and depends on crystal orientation and the imposed stress state. The relative ease of activating different slip systems (SS) was examined by analyzing the geometry of deformation in samples where a group of four solder balls were sheared to a set displacement at a shear strain rate of ~3 × 10$^{−6}$/s. By using orientation mapping and Schmid factor analysis, it was possible to identify which SS were most likely to be responsible for observed shape changes. This allows identification of which SS are more facile, which is a necessary foundation required to develop accurate crystal plasticity-based constitutive models for deformation of Sn. Preliminary results are compared with the literature, showing that slip in [001] directions is especially easy, and slip on {211} planes is less likely. These results show that the stress–strain response to a shear displacement differs considerably in each lead-free solder joint in a package, depending on the Sn crystal orientations and their location within the ball and the array.
Starting Page	2702
Ending Page	2711
Page Count	10
File Format	PDF
ISSN	03615235
Journal	Journal of Electronic Materials
Volume Number	38
Issue Number	12
e-ISSN	1543186X
Language	English
Publisher	Springer US
Publisher Date	2009-08-28
Publisher Place	Boston
Access Restriction	One Nation One Subscription (ONOS)
Subject Keyword	Slip systems shear strain crystal orientation tin Solid State Physics Electronics and Microelectronics, Instrumentation Characterization and Evaluation of Materials Optical and Electronic Materials
Content Type	Text
Resource Type	Article
Subject	Materials Chemistry Electronic, Optical and Magnetic Materials Condensed Matter Physics Electrical and Electronic Engineering

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