NDLI: Effect of rare earth element addition on the microstructure of Sn-Ag-Cu solder joint

Content Provider	Springer Nature Link
Author	Li, Bo Shi, Yaowu Lei, Yongping Guo, Fu Xia, Zhidong Zong, Bin
Copyright Year	2005
Abstract	The effects of minimal rare earth (RE) element additions on the microstructure of Sn-Ag-Cu solder joint, especially the intermetallic compounds (IMCs), were investigated. The range of RE content in Sn-Ag-Cu alloys varied from 0 wt.% to 0.25 wt.%. Experimental results showed that IMCs could be dramatically repressed with the appropriate addition of RE, resulting in a fine microstructure. However, there existed an effective range for the RE addition. The best RE content was found to be 0.1 wt.% in the current study. In addition to the typical morphology of Ag$_{3}$Sn and Cu$_{6}$Sn$_{5}$ IMCs, other types of IMCs that have irregular morphology and uncertain constituents were also observed. The IMCs with large plate shape mainly contained Ag and Sn, but the content of Ag was much lower than that of Ag$_{3}$Sn. The cross sections of Cu$_{6}$Sn$_{5}$ IMCs whiskers showed various morphologies. Furthermore, some eutectic-like structures, including lamellar-, rod-, and needle-like phases, were observed. The morphology of eutectic-like structure was related to the RE content in solder alloys. When the content of RE is 0.1 wt.%, the needle-like phase was dominant, while the lamellar structure prevailed when the RE content was 0.05 wt.% or 0.25 wt.%. It is suggested that the morphology change of the eutectic-like structure directly affects the creep properties of the solder joint.
Starting Page	217
Ending Page	224
Page Count	8
File Format	PDF
ISSN	03615235
Journal	Journal of Electronic Materials
Volume Number	34
Issue Number	3
e-ISSN	1543186X
Language	English
Publisher	Springer-Verlag
Publisher Date	2005-01-01
Publisher Place	New York
Access Restriction	One Nation One Subscription (ONOS)
Subject Keyword	Lead-free solder Sn-Ag-Cu alloys rare earth intermetallic compounds microstructure Optical and Electronic Materials Characterization and Evaluation of Materials Electronics and Microelectronics, Instrumentation Solid State Physics and Spectroscopy
Content Type	Text
Resource Type	Article
Subject	Materials Chemistry Electronic, Optical and Magnetic Materials Condensed Matter Physics Electrical and Electronic Engineering

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