NDLI: Study on Subgrain Rotation Behavior at Different Interfaces of a Solder Joint During Thermal Shock

Content Provider	Springer Nature Link
Author	Han, Jing Tan, Shihai Guo, Fu
Copyright Year	2016
Abstract	In order to investigate subgrain rotation behavior in the recrystallized region of lead-free solder joints, a ball grid array (BGA) specimen with a cross-sectioned edge row was thermally shocked. Electron backscattered diffraction (EBSD) was used to obtain the microstructure and orientations of Sn grains or subgrains in as-reflowed and thermally shocked conditions. Orientation imaging microscopy (OIM) showed that several subgrains were formed at the tilted twin grain boundaries, near the chip side and near the printed circuit board (PCB) side after 200 thermal shocks due to a highly mismatched coefficient of thermal expansion (CTE) of twin grains. Also, subgrains formed at the chip side and PCB side in the solder joint were selected to research the grain rotation behavior in lead-free solder joints. The analysis of subgrain rotation also indicated that the rotation behavior of subgrains was different between the chip side and PCB side. It was closely related with the large different crystal orientations between the chip side and PCB side. Furthermore, electron backscattered patterns (EBSPs) at several parts of the joint were not obtained after 300 thermal shocks due to the serious deformation caused by mismatched CTE during thermal shock. But 4 subgrains were selected and compared with that of the initial state and 200-thermal shock conditions. The results showed that the subgrains at the chip side were also rotated around the Sn [101] and [001] axes and the subgrains at the PCB side were also rotated around the Sn [100] axis, which indicated a continuous process of subgrain rotation.
Starting Page	6086
Ending Page	6094
Page Count	9
File Format	PDF
ISSN	03615235
Journal	Journal of Electronic Materials
Volume Number	45
Issue Number	12
e-ISSN	1543186X
Language	English
Publisher	Springer US
Publisher Date	2016-11-01
Publisher Place	New York
Access Restriction	One Nation One Subscription (ONOS)
Subject Keyword	Lead-free solder subgrain rotation EBSD grain orientation recrystallization Optical and Electronic Materials Characterization and Evaluation of Materials Electronics and Microelectronics, Instrumentation Solid State Physics
Content Type	Text
Resource Type	Article
Subject	Materials Chemistry Electronic, Optical and Magnetic Materials Condensed Matter Physics Electrical and Electronic Engineering

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