NDLI: Influence of Lanthanum Additions on the Microstructure and Microhardness of Sn-3.5Ag Solder

Content Provider	Springer Nature Link
Author	Lee, Hwa Teng Chen, Yin Fa
Copyright Year	2009
Abstract	This study evaluates the effects of different amounts of lanthanum (La) additions on the microstructure and microhardness of Sn-3.5Ag solders. Sn-3.5Ag-xLa ternary solders were prepared by adding 0 wt.% to 1.0 wt.% La to Sn-3.5Ag alloy. Copper substrates were then dipped in the molten solders and these samples aged at 150°C for up to 625 h. The microstructure and microhardness of the as-solidified solder and the aged solder/copper samples were investigated. The Sn-3.5Ag-xLa solders comprised β-Sn, Ag$_{3}$Sn, and LaSn$_{3}$ phases, and their microstructure was refined by La additions. As-cast, the addition of La increased the microhardness of the Sn-Ag solder due to the refining effect of Ag$_{3}$Sn particles and increased formation of LaSn$_{3}$ compounds. As the aging time was increased, the microhardness of the solders decreased and the Ag$_{3}$Sn compounds coarsened. However, the coarsening of Ag$_{3}$Sn compounds was retarded by La, and the size and amount of LaSn$_{3}$ compounds did not change perceptibly with aging time. Therefore, La additions can improve the microhardness and thermal resistance of solder joints.
Starting Page	2148
Ending Page	2157
Page Count	10
File Format	PDF
ISSN	03615235
Journal	Journal of Electronic Materials
Volume Number	38
Issue Number	10
e-ISSN	1543186X
Language	English
Publisher	Springer US
Publisher Date	2009-06-26
Publisher Place	Boston
Access Restriction	One Nation One Subscription (ONOS)
Subject Keyword	Rare-earth element lead-free solder microstructure intermetallic compound layer microhardness Solid State Physics and Spectroscopy Electronics and Microelectronics, Instrumentation Characterization and Evaluation of Materials Optical and Electronic Materials
Content Type	Text
Resource Type	Article
Subject	Materials Chemistry Electronic, Optical and Magnetic Materials Condensed Matter Physics Electrical and Electronic Engineering

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