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| Content Provider | Springer Nature Link |
|---|---|
| Author | Iue, N. Itoh, A. Kimoto, T. Matsunami, H. Nakata, T. Iue, M. |
| Copyright Year | 1997 |
| Abstract | N$^{+}$ implantation into p-type a-SiC (6H-SiC, 4H-SiC) epilayers at elevated temperatures was investigated and compared with implantation at room temperature (RT). When the implant dose exceeded 4 × 10$_{15}$ cm$_{−2}$, a complete amorphous layer was formed in RT implantation and severe damage remained even after post implantation annealing at 1500°C. By employing hot implantation at 500~800°C, the formation of a complete amorphous layer was suppressed and the residual damage after annealing was significantly reduced. For implant doses higher than 10$^{15}$ cm$^{−2}$, the sheet resistance of implanted layers was much reduced by hot implantation. The lowest sheet resistance of 542Ω/ was obtained by implantation at 500 ~ 800°C with a 4 × 10$^{15}$ cm$^{−2}$ dose. Characterization of n$^{+}$-p junctions fabricated by N$^{+}$ implantation into p-type epilayers was carried out in detail. The net doping concentration in the region close to the junction showed a linearly graded profile. The forward current was clearly divided into two components of diffusion and recombination. A high breakdown voltage of 615 ∼ 810V, that is almost an ideal value, was obtained, even if the implant dose exceeded 10$^{15}$ cm$^{−2}$. By employing hot implantation at 800°C, the reverse leakage current was significantly reduced. |
| Starting Page | 165 |
| Ending Page | 171 |
| Page Count | 7 |
| File Format | |
| ISSN | 03615235 |
| Journal | Journal of Electronic Materials |
| Volume Number | 26 |
| Issue Number | 3 |
| e-ISSN | 1543186X |
| Language | English |
| Publisher | Springer-Verlag |
| Publisher Date | 1997-01-01 |
| Publisher Place | New York |
| Access Restriction | One Nation One Subscription (ONOS) |
| Subject Keyword | Hot-implantation n$^{+}$-p junction Reverse leakage current Sheet resistance Silicon carbide Optical and Electronic Materials Characterization and Evaluation of Materials Electronics and Microelectronics, Instrumentation Solid State Physics and Spectroscopy |
| Content Type | Text |
| Resource Type | Article |
| Subject | Materials Chemistry Electronic, Optical and Magnetic Materials Condensed Matter Physics Electrical and Electronic Engineering |
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