NDLI: Cross-Interaction of Interfacial Reactions in Ni (Au/Ni/Cu)-SnAg-Cu Solder Joints during Reflow Soldering and Thermal Aging

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Cross-Interaction of Interfacial Reactions in Ni (Au/Ni/Cu)-SnAg-Cu Solder Joints during Reflow Soldering and Thermal Aging

Content Provider	Springer Nature Link
Author	Chen, H.T. Wang, C.Q. Yan, C. Li, M.Y. Huang, Y.
Copyright Year	2006
Abstract	Interfacial reactions in Ni-SnAg-Cu and Au/Ni/Cu-SnAg-Cu solder joints were investigated to understand the coupling effect between different pads during soldering and thermal aging processes. Scanning electron microscopy (SEM) was used to characterize the microstructures and phases. The element distributions in the joints were identified using the x-ray mapping technique. The thickness variation of intermetallic compounds (IMCs) with aging time was also measured. The results showed that interfacial reactions were not only affected by the compositions of solders and the local metallizations but the remote pads as well. The Au surface finish had an effect on the growth of IMCs at the interfaces. No redeposition of (Au, Ni)Sn$_{4}$ was found in the Au/Ni/Cu-SnAg-Cu solder joint. The effect of Cu on the formation of IMCs and redeposition of (Au, Ni)Sn$_{4 }$was also discussed.
Starting Page	26
Ending Page	32
Page Count	7
File Format	PDF
ISSN	03615235
Journal	Journal of Electronic Materials
Volume Number	36
Issue Number	1
e-ISSN	1543186X
Language	English
Publisher	Springer US
Publisher Date	2006-12-28
Publisher Place	Boston
Access Restriction	One Nation One Subscription (ONOS)
Subject Keyword	Intermetallic formation lead free solder aging solder intermetallic compounds interfacial reaction Solid State Physics and Spectroscopy Electronics and Microelectronics, Instrumentation Characterization and Evaluation of Materials Optical and Electronic Materials
Content Type	Text
Resource Type	Article
Subject	Materials Chemistry Electronic, Optical and Magnetic Materials Condensed Matter Physics Electrical and Electronic Engineering

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Cross-Interaction of Interfacial Reactions in Ni (Au/Ni/Cu)-SnAg-Cu Solder Joints during Reflow Soldering and Thermal Aging

Cross-Interaction of Interfacial Reactions in Ni (Au/Ni/Cu)-SnAg-Cu Solder Joints during Reflow Soldering and Thermal Aging

Cross-Interaction of Interfacial Reactions in Ni (Au/Ni/Cu)-SnAg-Cu Solder Joints during Reflow Soldering and Thermal Aging

Early Interfacial Reaction and Formation of Intermetallic Compounds in the Sn-3.5Ag/Cu Soldering System

Intermetallic reactions in Sn-3.5Ag solder ball grid array packages with Ag/Cu and Au/Ni/Cu pads

Interfacial reaction between Sn-0.7Cu (-Ni) solder and Cu substrate

The reactions between electroless Ni-Cu-P Deposit and 63Sn-37Pb flip chip solder bumps during reflow

Intermetallic compound formation and morphology evolution in the 95Pb5Sn flip-chip solder joint with Ti/Cu/Ni under bump metallization during reflow soldering

Reliability of In-48Sn solder/Au/Ni/Cu BGA packages during reflow process

Cross-Interaction of Interfacial Reactions in Ni (Au/Ni/Cu)-SnAg-Cu Solder Joints during Reflow Soldering and Thermal Aging

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