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Cross-Interaction of Interfacial Reactions in Ni (Au/Ni/Cu)-SnAg-Cu Solder Joints during Reflow Soldering and Thermal Aging
| Content Provider | Semantic Scholar |
|---|---|
| Author | Chen, Hongtao Wang, Chunqing Yan, Cheng Li, Mingyu Huang, Yudong |
| Copyright Year | 2007 |
| Abstract | Interfacial reactions in Ni-SnAg-Cu and Au/Ni/Cu-SnAg-Cu solder joints were investigated to understand the coupling effect between different pads during soldering and thermal aging processes. Scanning electron microscopy (SEM) was used to characterize the microstructures and phases. The element distributions in the joints were identified using the x-ray mapping technique. The thickness variation of intermetallic compounds (IMCs) with aging time was also measured. The results showed that interfacial reactions were not only affected by the compositions of solders and the local metallizations but the remote pads as well. The Au surface finish had an effect on the growth of IMCs at the interfaces. No redeposition of (Au, Ni)Sn4 was found in the Au/Ni/Cu-SnAg-Cu solder joint. The effect of Cu on the formation of IMCs and redeposition of (Au, Ni)Sn4 was also discussed. |
| Starting Page | 26 |
| Ending Page | 32 |
| Page Count | 7 |
| File Format | PDF HTM / HTML |
| DOI | 10.1007/s11664-006-0005-4 |
| Alternate Webpage(s) | https://page-one.springer.com/pdf/preview/10.1007/s11664-006-0005-4 |
| Alternate Webpage(s) | https://doi.org/10.1007/s11664-006-0005-4 |
| Volume Number | 36 |
| Language | English |
| Access Restriction | Open |
| Content Type | Text |
| Resource Type | Article |
