NDLI: Reaction of Liquid Sn-Ag-Cu-Ce Solders with Solid Copper

Content Provider	Springer Nature Link
Author	Chriaštel’ová, J. Rízeková Trnková, L. Pocisková Dimová, K. Ožvold, M.
Copyright Year	2011
Abstract	Small amounts of the rare-earth element Ce were added to the Sn-rich lead-free eutectic solders Sn-3.5Ag-0.7Cu, Sn-0.7Cu, and Sn-3.5Ag to improve their properties. The microstructures of the solders without Ce and with different amounts (0.1 wt.%, 0.2 wt.%, and 0.5 wt.%) of Ce were compared. The microstructure of the solders became finer with increasing Ce content. Deviation from this rule was observed for the Sn-Ag-Cu solder with 0.2 wt.% Ce, and for the Sn-0.7Cu eutectic alloy, which showed the finest microstructure without Ce. The melting temperatures of the solders were not affected. The morphology of intermetallic compounds (IMC) formed at the interface between the liquid solders and a Cu substrate at temperatures about 40°C above the melting point of the solder for dipping times from 2 s to 256 s was studied for the basic solder and for solder with 0.5 wt.% Ce addition. The morphology of the Cu$_{6}$Sn$_{5}$ IMC layer developed at the interface between the solders and the substrate exhibited the typical scallop-type shape without significant difference between solders with and without Ce for the shortest dipping time. Addition of Ce decreased the thickness of the Cu$_{6}$Sn$_{5}$ IMC layer only at the Cu/Sn-Ag-Cu solder interface for the 2-s dipping. A different morphology of the IMC layer was observed for the 256-s dipping time: The layers were less continuous and exhibited a broken relief. Massive scallops were not observed. For longer dipping times, Cu$_{3}$Sn IMC layers located near the Cu substrate were also observed.
Starting Page	1956
Ending Page	1961
Page Count	6
File Format	PDF
ISSN	03615235
Journal	Journal of Electronic Materials
Volume Number	40
Issue Number	9
e-ISSN	1543186X
Language	English
Publisher	Springer US
Publisher Date	2011-06-23
Publisher Place	Boston
Access Restriction	One Nation One Subscription (ONOS)
Subject Keyword	Lead-free solders Sn-Ag-Cu alloys rare earth Ce intermetallics microstructure Characterization and Evaluation of Materials Electronics and Microelectronics, Instrumentation Optical and Electronic Materials Solid State Physics
Content Type	Text
Resource Type	Article
Subject	Materials Chemistry Electronic, Optical and Magnetic Materials Condensed Matter Physics Electrical and Electronic Engineering

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