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  1. Journal of Electronic Materials
  2. Journal of Electronic Materials : Volume 38
  3. Journal of Electronic Materials : Volume 38, Issue 1, January 2009
  4. Foreword
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Journal of Electronic Materials : Volume 46
Journal of Electronic Materials : Volume 45
Journal of Electronic Materials : Volume 44
Journal of Electronic Materials : Volume 43
Journal of Electronic Materials : Volume 42
Journal of Electronic Materials : Volume 41
Journal of Electronic Materials : Volume 40
Journal of Electronic Materials : Volume 39
Journal of Electronic Materials : Volume 38
Journal of Electronic Materials : Volume 38, Issue 12, December 2009
Journal of Electronic Materials : Volume 38, Issue 11, November 2009
Journal of Electronic Materials : Volume 38, Issue 10, October 2009
Journal of Electronic Materials : Volume 38, Issue 9, September 2009
Journal of Electronic Materials : Volume 38, Issue 8, August 2009
Journal of Electronic Materials : Volume 38, Issue 7, July 2009
Journal of Electronic Materials : Volume 38, Issue 6, June 2009
Journal of Electronic Materials : Volume 38, Issue 5, May 2009
Journal of Electronic Materials : Volume 38, Issue 4, April 2009
Journal of Electronic Materials : Volume 38, Issue 3, March 2009
Journal of Electronic Materials : Volume 38, Issue 2, February 2009
Journal of Electronic Materials : Volume 38, Issue 1, January 2009
Foreword
Microstructural Evolution of Alloy Powder for Electronic Materials with Liquid Miscibility Gap
Cu-Ni-Sn: A Key System for Lead-Free Soldering
Interfacial Reaction and Wetting Behavior Between Pt and Molten Solder
Improvement of Thermal Fatigue Properties of Sn-Ag-Cu Lead-Free Solder Interconnects on Casio’s Wafer-Level Packages Based on Morphology and Grain Boundary Character
Effects of Co Addition on Bulk Properties of Sn-3.5Ag Solder and Interfacial Reactions with Ni-P UBM
Effect of Ni-Cr Layer on Adhesion Strength of Flexible Copper Clad Laminate
Interfacial Reaction between Zn-Al-Based High-Temperature Solders and Ni Substrate
Effect of Cu Thickness on the Evolution of the Reaction Products at the Sn-9wt.%Zn Solder/Cu Interface During Reflow
Electromigration Behavior in Sn-37Pb and Sn-3.0Ag-0.5Cu Flip-Chip Solder Joints under High Current Density
Effect of Electromigration on the Mechanical Performance of Sn-3.5Ag Solder Joints with Ni and Ni-P Metallizations
Suppressing Growth of the Cu$_{5}$Zn$_{8}$ Intermetallic Layer in Sn-Zn-Ag-Al-Ga/Cu Solder Joints
Interfacial Reactions Between Pb-Free Solders and In/Ni/Cu Multilayer Substrates
Thermal Stability Study of Cu(MoN$_{ x }$) Seed Layer on Barrierless Si
Reflectivity and Abnormal Absorption at ITO/Al Interface
Phase Transitions in the BiVO$_{4}$-nPbO (n = 1, 2) System: Structural–Electrical Properties Relationships
Optical Characteristics of ZnTeO Thin Films Synthesized by Pulsed Laser Deposition and Molecular Beam Epitaxy
Multiple-Scale Analysis of Charge Transport in Semiconductor Radiation Detectors: Application to Semi-Insulating CdZnTe
Fabrication of Mesa Shaped InGaN-Based Light-Emitting Diodes Through a Photoelectrochemical Process
Nearly Perfect Electrical Activation Efficiencies from Silicon-Implanted Al$_{ x }$Ga$_{1−x }$N with High Aluminum Mole Fraction
A Study on a Surface Preparation Method for Single-Crystal SiC Using an Fe Catalyst
Ceramic Substrates for High-temperature Electronic Integration
Factors That Govern the Performance of Thermal Interface Materials
Synthesis of Nanostructured Carbon Materials on a Tin Thin Film Using Phenol Formaldehyde as the Carbon Source
A Hermetic Seal Using Composite Thin-Film In/Sn Solder as an Intermediate Layer and Its Interdiffusion Reaction with Cu
Simulation, Modeling, and Crystal Growth of Cd$_{0.9}$Zn$_{0.1}$Te for Nuclear Spectrometers : Erratum to Volume 35, Number 6, June 2006, pp. 1251–1256
Journal of Electronic Materials : Volume 37
Journal of Electronic Materials : Volume 36
Journal of Electronic Materials : Volume 35
Journal of Electronic Materials : Volume 34
Journal of Electronic Materials : Volume 33
Journal of Electronic Materials : Volume 32
Journal of Electronic Materials : Volume 31
Journal of Electronic Materials : Volume 30
Journal of Electronic Materials : Volume 29
Journal of Electronic Materials : Volume 28
Journal of Electronic Materials : Volume 27
Journal of Electronic Materials : Volume 26

Foreword

Content Provider Springer Nature Link
Author Chen, Sinn wen Chada, Srinivas Chen, Chih ming Flandorfer, Hans Lindsay Greer, A. Lee, Jae Ho Zeng, Kejun Suganuma, Katsuaki
Copyright Year 2008
Starting Page 1
Ending Page 1
Page Count 1
File Format PDF
ISSN 03615235
Journal Journal of Electronic Materials
Volume Number 38
Issue Number 1
e-ISSN 1543186X
Language English
Publisher Springer US
Publisher Date 2008-10-08
Publisher Place Boston
Access Restriction One Nation One Subscription (ONOS)
Subject Keyword Solid State Physics and Spectroscopy Electronics and Microelectronics, Instrumentation Characterization and Evaluation of Materials Optical and Electronic Materials
Content Type Text
Subject Materials Chemistry Electronic, Optical and Magnetic Materials Condensed Matter Physics Electrical and Electronic Engineering
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