NDLI: An Evaluation Method for Tensile Characteristics of Cu/Sn IMCs Using Miniature Composite Solder Specimen

Content Provider	Springer Nature Link
Author	Ohguchi, Ken ichi Kurosawa, Kengo
Copyright Year	2016
Abstract	In design of electronic packages, finite-element method (FEM) analysis for evaluating the strength and reliability of solder joints should be conducted with consideration of the presence of Cu/Sn intermetallic compounds (IMCs) generated at the interface between solder and copper wiring. To conduct such analysis accurately, the deformation characteristics of Cu/Sn IMCs must be clarified by conducting tensile tests. This paper describes a method to evaluate tensile characteristics of Cu/Sn IMCs. The method employs a composite specimen with first outer layer of Cu, second layer of Cu/Sn IMCs, and core of Sn-3.0Ag-0.5Cu lead-free solder. The specimen is made by a method in which a copper-plated solder specimen is heat treated at 453 K to generate Cu/Sn IMCs between the solder and copper. Tensile tests were conducted using the composite specimen. After the tests, the fracture appearance and characteristics of the stress–strain relations of the specimens were investigated. Based on the results, a numerical method based on the rule of mixtures (ROM) is proposed to estimate the stress–strain relation of Cu/Sn IMCs under tensile loading.
Starting Page	3183
Ending Page	3191
Page Count	9
File Format	PDF
ISSN	03615235
Journal	Journal of Electronic Materials
Volume Number	45
Issue Number	6
e-ISSN	1543186X
Language	English
Publisher	Springer US
Publisher Date	2016-03-22
Publisher Place	New York
Access Restriction	One Nation One Subscription (ONOS)
Subject Keyword	Solder miniature specimen intermetallic compounds rule of mixtures tensile test stress–strain relation Optical and Electronic Materials Characterization and Evaluation of Materials Electronics and Microelectronics, Instrumentation Solid State Physics
Content Type	Text
Resource Type	Article
Subject	Materials Chemistry Electronic, Optical and Magnetic Materials Condensed Matter Physics Electrical and Electronic Engineering

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