NDLI: RF/wireless-interconnect: The next wave of connectivity

Please wait, while we are loading the content...

The driving force for development of IC and system in future: Reducing the power consumption and improving the ratio of performance to power consumption

Variability in nanoscale CMOS technology

Advanced strain engineering for state-of-the-art nanoscale CMOS technology

Next-generation lithography for 22 and 16 nm technology nodes and beyond

Inelastic electron tunneling spectroscopy (IETS) study of high-k gate dielectrics

Ultra-thin films and multigate devices architectures for future CMOS scaling

Si nanowire FET and its modeling

3D integration review

RF/wireless-interconnect: The next wave of connectivity

State-of-the-art flash memory devices and post-flash emerging memories

Phase change memory

Resistance switching for RRAM applications

High power devices in wide bandgap semiconductors

Low power 3.1–10.6 GHz IR-UWB transmitter for Gbps wireless communications

Science in China Series : Information Sciences : Volume 54, Issue 4, April 2011

Science in China Series : Information Sciences : Volume 54, Issue 3, March 2011

Science in China Series : Information Sciences : Volume 54, Issue 2, February 2011

Science in China Series : Information Sciences : Volume 54, Issue 1, January 2011

Science in China Series : Information Sciences : Volume 53

Science in China Series : Information Sciences : Volume 52

Science in China Series : Information Sciences : Volume 51

Science in China Series : Information Sciences : Volume 50

Science in China Series : Information Sciences : Volume 49

Science in China Series : Information Sciences : Volume 48

Science in China Series : Information Sciences : Volume 47

Science in China Series : Information Sciences : Volume 46

Science in China Series : Information Sciences : Volume 45

Science in China Series : Information Sciences : Volume 44

RF/wireless-interconnect: The next wave of connectivity

Content Provider	Springer Nature Link
Author	Tam, SaiWang Chang, Mau Chung Frank
Copyright Year	2011
Abstract	In the era of the nanometer CMOS technology, due to stringent system requirements in power, performance and other fundamental physical limitations (such as mechanical reliability, thermal constraints, overall system form factor, etc.), future VLSI systems are relying more on ultra-high data rates (up to 100 Gbps/pin or 20 Tbps aggregate), scalable, re-configurable, highly compact and reliable interconnect fabric. To overcome such challenges, we first explore the use of multiband RF/wireless-interconnects which can communicate simultaneously through multiple frequency bands with low power signal transmission, reconfigurable bandwidth and excellent mechanical flexibility and reliability. We then review recent advances in RF/wireless-interconnect in four different potential application domains, which include network-on-chips (NoCs), 3-dimensional integrated circuit (3DIC), advanced memory interface and ultra-high speed contactless connectors. Based on those developments, we further propose the future research direction on future inter- and intra-VLSI interconnect system through the comparison of performance and the proper communication range for all three types of interconnects, including communication data throughput, range and power consumption (pJ/bit) among the RF/wireless-interconnects, the optical interconnects and traditional parallel repeated bus.
Starting Page	1026
Ending Page	1038
Page Count	13
File Format	PDF
ISSN	1674733X
Journal	Science in China Series : Information Sciences
Volume Number	54
Issue Number	5
e-ISSN	18691919
Language	English
Publisher	SP Science China Press
Publisher Date	2011-05-05
Publisher Place	Heidelberg
Access Restriction	One Nation One Subscription (ONOS)
Subject Keyword	RF-interconnect wireless RF-interconnect network-on-chips multi-band 3-dimensional integrated circuit advanced memory interface wireless contactless connector Information Systems and Communication Service
Content Type	Text
Resource Type	Article
Subject	Computer Science

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

Wireline/wireless RF-Interconnect for future SoC

A simultaneous tri-band on-chip RF-interconnect for future network-on-chip

Design Methodology for a Robust and Energy-Efficient Millimeter-Wave Wireless Network-on-Chip

Advanced RF/baseband interconnect schemes for inter- and intra-ULSI communications

Energy-Efficient Multi-Band Signaling for High-Speed Memory Interface

Exploiting multi-interface networks: Connectivity and Cheapest Paths

High performance hybrid NoCs design with wireless/RF-I

A self-synchronized RF-interconnect for 3-dimensional integrated circuits

Radio frequency reliability studies of CMOS RF integrated circuits for ultra-thin flexible packages

RF/wireless-interconnect: The next wave of connectivity

Similar Documents

Wireline/wireless RF-Interconnect for future SoC

A simultaneous tri-band on-chip RF-interconnect for future network-on-chip

Design Methodology for a Robust and Energy-Efficient Millimeter-Wave Wireless Network-on-Chip

Advanced RF/baseband interconnect schemes for inter- and intra-ULSI communications

Energy-Efficient Multi-Band Signaling for High-Speed Memory Interface

Exploiting multi-interface networks: Connectivity and Cheapest Paths

High performance hybrid NoCs design with wireless/RF-I

A self-synchronized RF-interconnect for 3-dimensional integrated circuits

Radio frequency reliability studies of CMOS RF integrated circuits for ultra-thin flexible packages

RF/wireless-interconnect: The next wave of connectivity