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| Content Provider | Springer Nature Link |
|---|---|
| Author | Boyce, B. L. |
| Copyright Year | 2009 |
| Abstract | A high-throughput sequential tensile test method has been developed to characterize the fracture strength distribution of microfabricated polycrystalline silicon, the primary structural material used in microelectromechanical systems (MEMS). The resulting dataset of over 1,000 microtensile tests reveals subtle extreme-value behavior in the tails of the distribution, demonstrating that the common two-parameter Weibull distribution is inferior to a three-parameter Weibull model. The results suggest the existence of a cut-off or threshold stress (1.446 GPa for this particular material) below which tensile failure will not occur. The existence of a cut-off stress suggests that the material’s flaw size distribution and toughness distribution are both also bounded. From an application perspective, the cut-off stress provides a statistically-sound basis for reliable design. While the sequential method is demonstrated here for tensile strength distributions in polycrystalline silicon MEMS, the technique could be extended to a wide range of mechanical tests (bending strength, elastic modulus, fracture toughness, creep, etc.) for both microsystem and conventional materials. |
| Starting Page | 993 |
| Ending Page | 997 |
| Page Count | 5 |
| File Format | |
| ISSN | 00144851 |
| Journal | Experimental Mechanics |
| Volume Number | 50 |
| Issue Number | 7 |
| e-ISSN | 17412765 |
| Language | English |
| Publisher | Springer US |
| Publisher Date | 2009-09-24 |
| Publisher Place | Boston |
| Access Restriction | One Nation One Subscription (ONOS) |
| Subject Keyword | Silicon MEMS Fracture Strength Weibull Mechanics Vibration, Dynamical Systems, Control Structural Mechanics Optics, Optoelectronics, Plasmonics and Optical Devices Characterization and Evaluation of Materials Continuum Mechanics and Mechanics of Materials |
| Content Type | Text |
| Resource Type | Article |
| Subject | Mechanics of Materials Mechanical Engineering Aerospace Engineering |
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