NDLI: Study on preparation and properties of novel reactive phenolic hydroxyl-containing polyimides

Content Provider	Springer Nature Link
Author	Shen, Jie Zhang, Ying Huang, Mingfu Wang, Wenhao Xu, Zushun Yeung, Kelvin W. K. Yi, Changfeng Xu, Ming
Copyright Year	2012
Abstract	Novel reactive polyimides (PIs) containing phenolic hydroxyl functionalities were prepared from 4-(4-hydroxyphenyl)-2,6-bis[3-(4-aminophenoxy)phenyl]pyridine (m,p-HAPP) with various aromatic dianhydrides via one-step polycondensation procedure. The inherent viscosities of the PIs were 0.54–0.63 dL/g in DMF solution and most of them were readily soluble in common organic solvents such as DMF, DMAc, NMP, and m-Cresol, etc. Meanwhile, the PIs also had good thermal stability, with the glass transition temperature (T $_{g}$) of 221.7–310.5 °C, the temperature at 10 % weight loss of 524.1–579.3 °C in nitrogen atmosphere. Then commercial epoxy resin was cured in the presence of different ratios of the reactive polyimide, giving a series of polyimide modified epoxy films. Thermogravimetric analysis showed the increase of the temperature at 5 % weight loss of the films with the increase of the polyimide content; 296 °C for 0 %, 309 °C for 1.95 %, 337 °C for 3.85 % and 350 °C for 5.63 %.
Starting Page	1
Ending Page	9
Page Count	9
File Format	PDF
ISSN	10229760
Journal	Journal of Polymer Research
Volume Number	19
Issue Number	5
e-ISSN	15728935
Language	English
Publisher	Springer Netherlands
Publisher Date	2012-04-12
Publisher Place	Dordrecht
Access Restriction	One Nation One Subscription (ONOS)
Subject Keyword	Hydroxyl-containing diamine Reactive polyimide Epoxy resin Thermal stability Industrial Chemistry/Chemical Engineering Polymer Sciences Characterization and Evaluation of Materials
Content Type	Text
Resource Type	Article
Subject	Organic Chemistry Materials Chemistry Polymers and Plastics

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