NDLI: Mechanical strength and fracture mode transition of Sn-58Bi epoxy solder joints under high-speed shear test

Content Provider	Springer Nature Link
Author	Cho, Ilje Ahn, Jee Hyuk Yoon, Jeong Won Shin, Young Eui Jung, Seung Boo
Copyright Year	2012
Abstract	The shear force and failure behaviors of the Sn-58Bi epoxy solder joints with various surface finishes under the high-speed shear test were investigated. The relationships between the shear speed, shear force, and fracture mode are elucidated in this study. The shear force of the Sn-58Bi solder joints increased with increasing shear speed, mainly due to the high strain-rate sensitivity of the solder alloys. Brittle interfacial fractures were more easily achieved at higher shear speed in the high-speed shear test. This result was discussed in terms of the relationship between the strain-rate of the solder alloy, the work-hardening effect, and the resulting stress concentration in the interfacial regions. The fracture mode changed from ductile solder fracture to brittle interfacial fracture with increasing shear speed. On the other hand, the different surface finish materials did not affect the shear force and fracture mode of the Sn-58Bi solder joints under high-speed shear loading.
Starting Page	1515
Ending Page	1520
Page Count	6
File Format	PDF
ISSN	09574522
Journal	Journal of Materials Science: Materials in Electronics
Volume Number	23
Issue Number	8
e-ISSN	1573482X
Language	English
Publisher	Springer US
Publisher Date	2012-03-11
Publisher Place	Boston
Access Restriction	One Nation One Subscription (ONOS)
Subject Keyword	Optical and Electronic Materials Characterization and Evaluation of Materials
Content Type	Text
Resource Type	Article
Subject	Atomic and Molecular Physics, and Optics Biomaterials Biophysics Condensed Matter Physics Electronic, Optical and Magnetic Materials Bioengineering Electrical and Electronic Engineering Biomedical Engineering

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