NDLI: Effect of Y$_{2}$O$_{3}$ particles on microstructure formation and shear properties of Sn-58Bi solder

Content Provider	Springer Nature Link
Author	Liu, Xiaoying Huang, Mingliang Wu, C. M. L. Wang, Lai
Copyright Year	2009
Abstract	In the present study, varying weight percentages of Y$_{2}$O$_{3}$ particles (3–5 μm) from 0 to 3% were incorporated into eutectic Sn-Bi solder matrix to form composite solders. It is found that the reinforcement particles were well dispersed in the solder matrix. They depressed the growth of intermetallic compound (IMC) layers and reduced the size of IMC grains. Since the Y$_{2}$O$_{3}$ particles serve as additional nucleation sites for the formation of primary Bi-rich phase, the size of both Bi-rich phase and the IMCs were decreased gradually with the Y$_{2}$O$_{3}$ content increasing. Shear tests were also conducted on as—soldered joints. The growth of solid-state intermetallic compounds layer was examined by thermal aging of the solder/Cu couple for a temperature range from 60 to 120°C and time periods from 50 to 500 h. Compared with Sn-58Bi solder, finer eutectic microstructures were obtained with Y$_{2}$O$_{3}$ addition after long time aging. The apparent activation energies calculated for the growth of the intermetallic compound layers were 72 ± 5 kJ/mol of Sn-58Bi, 74 ± 4 kJ/mol of Sn-58Bi-0.5wt%Y$_{2}$O$_{3}$, 81 ± 5 kJ/mol of Sn-58Bi-1wt% Y$_{2}$O$_{3}$ and 81 ± 7 kJ/mol of Sn-58Bi-3wt.% Y$_{2}$O$_{3}$, respectively.
Starting Page	1046
Ending Page	1054
Page Count	9
File Format	PDF
ISSN	09574522
Journal	Journal of Materials Science: Materials in Electronics
Volume Number	21
Issue Number	10
e-ISSN	1573482X
Language	English
Publisher	Springer US
Publisher Date	2009-11-29
Publisher Place	Boston
Access Restriction	One Nation One Subscription (ONOS)
Subject Keyword	Characterization and Evaluation of Materials Optical and Electronic Materials
Content Type	Text
Resource Type	Article
Subject	Atomic and Molecular Physics, and Optics Biomaterials Biophysics Condensed Matter Physics Electronic, Optical and Magnetic Materials Bioengineering Electrical and Electronic Engineering Biomedical Engineering

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