NDLI: Effect of Ti on the interfacial reaction between Sn and Cu

Content Provider	Springer Nature Link
Author	Vuorinen, V. Dong, H. Q. Laurila, T.
Copyright Year	2011
Abstract	The effect of Ti on the solid state reactions between Sn and Cu has been investigated in this work. Based on the experimental results the following statements about the effect of Ti can be made: Firstly, the presence of Ti does not have measurable effect on the thickness of either Cu$_{6}$Sn$_{5}$ or Cu$_{3}$Sn during solid state annealing. However, the unevenness of both Cu$_{6}$Sn$_{5}$ and Cu$_{3}$Sn layers is increased by the addition of Ti. Secondly, there is no marked solubility of Ti to either Cu$_{6}$Sn$_{5}$ or Cu$_{3}$Sn. Rather Ti reacts with Sn to form large Ti$_{2}$Sn$_{3}$ platelets inside the solder matrix. These findings were subsequently rationalized with the help of the assessed Cu–Sn–Ti phase diagram. By utilizing this phase diagram information, the absence of any marked effects of Ti on the growth of Cu–Sn intermetallic compound (IMC) formation was rationalized. As there is a very low solubility of Ti to SnAg solder and to Cu–Sn IMC’s, Ti cannot change activities of components in the solder nor influence the stability of the IMC layers. Hence, these results throw significant doubts over the concept of trying to influence the Cu–Sn IMC layer thickness or quality by Ti alloying.
Starting Page	68
Ending Page	74
Page Count	7
File Format	PDF
ISSN	09574522
Journal	Journal of Materials Science: Materials in Electronics
Volume Number	23
Issue Number	1
e-ISSN	1573482X
Language	English
Publisher	Springer US
Publisher Date	2011-06-12
Publisher Place	Boston
Access Restriction	One Nation One Subscription (ONOS)
Subject Keyword	Characterization and Evaluation of Materials Optical and Electronic Materials
Content Type	Text
Resource Type	Article
Subject	Atomic and Molecular Physics, and Optics Biomaterials Biophysics Condensed Matter Physics Electronic, Optical and Magnetic Materials Bioengineering Electrical and Electronic Engineering Biomedical Engineering

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