NDLI: Interfacial reaction between Au and Sn films electroplated for LED bumps

Content Provider	Springer Nature Link
Author	Huang, M. L. Liu, Y. Gao, J. X.
Copyright Year	2010
Abstract	Au-20 wt% Sn eutectic solder is used as bumps in flip chip package of power LED (Light Emitting Diode) due to its excellent properties. The Au/Sn dual-layer films were fabricated on Si wafer by pulse electroplating of Au and Sn sequentially, and the solid–solid interfacial reaction during aging and the eutectic reaction during reflow soldering were investigated in the present work. After storage at room temperature for 1 week, three phases of AuSn, AuSn$_{2}$ and AuSn$_{4}$ were sequentially formed at the Au/Sn (10 μm/10 μm) interface, and the thickness of this reaction region was about 5 μm. Firstly, AuSn$_{4}$ was formed at the Au/Sn interface, and then AuSn and AuSn$_{2}$ were formed at the Au/AuSn$_{4}$ interface. After aging at 150 °C for 5 and 10 h, a similar layered structure of AuSn/AuSn$_{2}$/AuSn$_{4}$ was also observed. Due to the faster diffusion of Au to Sn layer, all the Sn elements were consumed after aging at 150 °C for 15 h and AuSn$_{4}$ layer gradually transformed into AuSn and AuSn$_{2}$ layers. For the specimen of Au/Sn (9 μm/6 μm) films on Si chip, a bamboo-shoot-like microstructure of Au$_{5}$Sn/AuSn/AuSn$_{2}$ was formed in the reaction region after reflowed at 280 °C for 10 s; while a typical two-phase (Au$_{5}$Sn and AuSn) eutectic microstructure was formed after reflowed at 280 °C for 60 s.
Starting Page	193
Ending Page	199
Page Count	7
File Format	PDF
ISSN	09574522
Journal	Journal of Materials Science: Materials in Electronics
Volume Number	22
Issue Number	2
e-ISSN	1573482X
Language	English
Publisher	Springer US
Publisher Date	2010-05-12
Publisher Place	Boston
Access Restriction	One Nation One Subscription (ONOS)
Subject Keyword	Characterization and Evaluation of Materials Optical and Electronic Materials
Content Type	Text
Resource Type	Article
Subject	Atomic and Molecular Physics, and Optics Biomaterials Biophysics Condensed Matter Physics Electronic, Optical and Magnetic Materials Bioengineering Electrical and Electronic Engineering Biomedical Engineering

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