NDLI: Creep failure mechanism and life prediction of lead-free solder joint

Content Provider	Springer Nature Link
Author	Zhu, Yongxin Li, Xiaoyan Gao, Ruiting
Copyright Year	2014
Abstract	The reliability of solder joints in electronic products has received a lot of concern. The creep behavior is an important property for lead-free solder. In this research, creep tests were conducted to the Sn3.0Ag0.5Cu solder joints. Creep failure mechanism was analyzed and creep life was evaluated based on the Monkman–Grant and Larson–Miller parameter model. The results show that separation is easy to take place at dendrite grain boundaries. Creep cavity initiates at triple junctions of dendrite grains in solder matrix near the intermetallic compound layer. The creep fracture morphology at low temperature and high stress comprises three regions: the shear plane, shear lip and the instantaneous rupture zone. However, the shear plane region is disappeared with increasing the temperature and decreasing the stress. The rupture surface is characterized by the shear lip and inter-granular failure morphology. The Monkman–Grant equation and Larson–Miller parameter model can be used to predict the solder joint creep life.
Starting Page	267
Ending Page	272
Page Count	6
File Format	PDF
ISSN	09574522
Journal	Journal of Materials Science: Materials in Electronics
Volume Number	26
Issue Number	1
e-ISSN	1573482X
Language	English
Publisher	Springer US
Publisher Date	2014-10-18
Publisher Place	Boston
Access Restriction	One Nation One Subscription (ONOS)
Subject Keyword	Optical and Electronic Materials Characterization and Evaluation of Materials
Content Type	Text
Resource Type	Article
Subject	Atomic and Molecular Physics, and Optics Biomaterials Biophysics Condensed Matter Physics Electronic, Optical and Magnetic Materials Bioengineering Electrical and Electronic Engineering Biomedical Engineering

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