NDLI: Measurement and prediction of Young’s modulus of a Pb-free solder

Content Provider	Springer Nature Link
Author	Chawla, N. Ochoa, F. Ganesh, V. V. Deng, X. Koopman, M. Chawla, K. K. Scarritt, S.
Copyright Year	2004
Abstract	Accurate and reproducible measurements of the Young’s modulus of solders are complicated by the early onset of yielding, microporosity, and variations in cooling rate. In this study, we report measurements of Young’s modulus of an Sn–3.5 wt % Ag solder by two techniques: (a) loading–unloading measurements in tension, and (b) non-destructive resonant ultrasound spectroscopy. Both techniques yielded similar values of Young’s modulus. The modulus decreased with increasing microporosity, in accordance with predicted values. Cooling rate affected the Ag$_{3}$Sn intermetallic morphology, but not Young’s modulus since the distribution of the particles was relatively random. This result was confirmed by microstructure-based finite element modeling.
Starting Page	385
Ending Page	388
Page Count	4
File Format	PDF
ISSN	09574522
Journal	Journal of Materials Science: Materials in Electronics
Volume Number	15
Issue Number	6
e-ISSN	1573482X
Language	English
Publisher	Kluwer Academic Publishers
Publisher Date	2004-01-01
Publisher Place	Boston
Access Restriction	One Nation One Subscription (ONOS)
Subject Keyword	Optical and Electronic Materials Characterization and Evaluation Materials
Content Type	Text
Resource Type	Article
Subject	Atomic and Molecular Physics, and Optics Biomaterials Biophysics Condensed Matter Physics Electronic, Optical and Magnetic Materials Bioengineering Electrical and Electronic Engineering Biomedical Engineering

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