NDLI: Analysis and design of an electrostatic MEMS microphone using the PolyMUMPs process

Content Provider	Springer Nature Link
Author	Grixti, Ryan Grech, Ivan Casha, Owen Darmanin, Jean Marie Gatt, Edward Micallef, Joseph
Copyright Year	2015
Abstract	This paper presents the analysis and design of an electrostatic MEMS microphone using the PolyMUMPs process with an additional back-etch processing step. Circular and square (simply supported and clamped) diaphragm designs are considered and analyzed, with the final design being based on the clamped square diaphragm with a bottom sound port. Although simply supported diaphragms exhibit high sensitivity for a given size, most MEMS fabrication processes such as the PolyMUMPS process, can only support clamped diaphragms. The effect of the back chamber volume on the microphone sensitivity is also investigated. The bias voltage is 6 V and the diaphragm has a side-length of 675 µm. The back-plate includes several holes which amount to a perforation ratio of 0.33. The maximum allowable input pressure before pull-in is 139 dB SPL. The microphone with a back-chamber volume of 6 mm3 exhibits a sensitivity of 8.4 mV/Pa at 94 dB SPL at an operating frequency of 1 kHz.
Starting Page	599
Ending Page	610
Page Count	12
File Format	PDF
ISSN	09251030
Journal	Analog Integrated Circuits and Signal Processing
Volume Number	82
Issue Number	3
e-ISSN	15731979
Language	English
Publisher	Springer US
Publisher Date	2015-01-13
Publisher Place	Boston
Access Restriction	One Nation One Subscription (ONOS)
Subject Keyword	MEMS Microphones Diaphragm geometry PolyMUMPs Circuits and Systems Electrical Engineering Signal, Image and Speech Processing
Content Type	Text
Resource Type	Article
Subject	Surfaces, Coatings and Films Signal Processing Hardware and Architecture

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4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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