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| Content Provider | Springer Nature Link |
|---|---|
| Author | Colinjivadi, Karthik S. Cui, Yonghao Ellis, Matthew Skidmore, George Lee, Jeong Bong |
| Copyright Year | 2008 |
| Abstract | We report our study on several de-tethering methods for various high aspect ratio metallic and polymeric MEMS and NEMS parts including 5:1 aspect ratio 50 μm thick metallic (nickel) MEMS parts, 3:1 aspect ratio 1 μm thick sub-micron (350 nm) feature size metallic NEMS actuators, and 10:1 aspect ratio 100 μm thick polymer/metal bi-layer MEMS actuators. Resistive heating was found to be effective for the de-tethering of high aspect ratio metallic MEMS parts. In order to de-tether metallic NEMS parts and polymer/metal bi-layer devices, we performed the milling of tethers using a focused ion beam. Very low current (20 pA) ion beam was found to be effective means of de-tethering the metallic NEMS parts. Relatively larger current (0.3–20 nA) ion beam was found to be good for the polymer/metal bi-layer parts. We demonstrated 3D assembly and complete packaging of the de-tethered high aspect ratio metallic and metal/polymer bilayer MEMS parts. |
| Starting Page | 1621 |
| Ending Page | 1626 |
| Page Count | 6 |
| File Format | |
| ISSN | 09467076 |
| Journal | Microsystem Technologies |
| Volume Number | 14 |
| Issue Number | 9-11 |
| e-ISSN | 14321858 |
| Language | English |
| Publisher | Springer-Verlag |
| Publisher Date | 2008-07-25 |
| Publisher Place | Berlin, Heidelberg |
| Access Restriction | One Nation One Subscription (ONOS) |
| Subject Keyword | Mechanical Engineering Nanotechnology Electronics and Microelectronics, Instrumentation |
| Content Type | Text |
| Resource Type | Article |
| Subject | Nanoscience and Nanotechnology Condensed Matter Physics Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering Hardware and Architecture |
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