NDLI: Solders development and application process for a micro chip-camera

Content Provider	Springer Nature Link
Author	Bobzin, Kirsten Lugscheider, Erich Ernst, Felix Nickel, Reimo Bagcivan, Nazlim Parkot, Daniel Schlegel, Arne Ferrara, Stefania Kashko, Tatyana Leick, émi
Copyright Year	2008
Abstract	Nowadays, micro components have to fulfill rising optical requirements for different scientific and industrial fields like astronomy, medicine or multimedia. For this purpose, advanced miniaturized chip-cameras are produced for the microsystems engineering market. The assembly and joining technologies play a very important role in the production of these micro components. Several challenges are associated with the joining of chip-cameras. In this study, the application of the soldering technology has been considered in order to face these challenges. Two joining technologies have been investigated: active soldering and transient liquid phase (TLP) bonding. Both soldering processes have shown a big potential for hybrid microsystems joining in previous studies. For both processes, soldering alloys and parameters have been conceived in order to fulfill the joining requirements of the micro camera components. For instance, the joining temperature represents a major challenge because the chip-camera consists of a plastic material, polymethyl methacrylate (PMMA). Therefore, particular attention has been directed to the soldering as well as to the coating temperature. The experimental investigations concerning the solders application through physical vapor deposition (PVD) have been supported by finite element method (FEM) simulations. The analysis of the temperature distribution in the micro components during the coating process was the focus of the calculations. Possible undesirable local overheated areas of the chip-camera components can be detected through simulation.
Starting Page	1887
Ending Page	1894
Page Count	8
File Format	PDF
ISSN	09467076
Journal	Microsystem Technologies
Volume Number	14
Issue Number	12
e-ISSN	14321858
Language	English
Publisher	Springer-Verlag
Publisher Date	2008-04-04
Publisher Place	Berlin, Heidelberg
Access Restriction	One Nation One Subscription (ONOS)
Subject Keyword	Mechanical Engineering Nanotechnology Electronics and Microelectronics, Instrumentation
Content Type	Text
Resource Type	Article
Subject	Nanoscience and Nanotechnology Condensed Matter Physics Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering Hardware and Architecture

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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