NDLI: Multidimensional line dispensing of unfilled adhesives

Content Provider	Springer Nature Link
Author	Reisgen, U. Scheik, S.
Copyright Year	2008
Abstract	In comparison with competitive joining methods, the joining technology “adhesive bonding”, provides advantages in the low-stress joining of similar and dissimilar material combinations. As far as the micro-range is concerned, this technology is particularly suitable for the joining of hybrid micro-systems made of different materials and featuring complex geometries. The variety of available adhesives allows the adaptation of the process to the specific joining task. If the technology is transferred from the macro-range to the micro-range, the dispensing and application of the requested minimal adhesive volumes is one of the fundamental challenges. The process limits of nowadays-used micro-dispensing systems are characterised by the minimally dispensable adhesive volume and also by the flexibility with regard to the applicable adhesives and dispensable layout. The objective of the research work, which is specified in this paper is the expansion of the process limits up to smaller volumes and also the guarantee of flexible handling and a high-process stability. This has been the motivation for the Welding and Joining Institute of the RWTH Aachen to develop a micro-dispensing unit for spot and linear adhesive application. The unit comprises a positive-displacement dispensing system with integrated adhesive tempering, process gas supply and process optics. A reproducible dispensing process requires the adhesive reservoir to be absolutely free from gas. For this reason, a one-way system has been developed which allows degasification before the actual dispensing process takes place. Different degasification principles have, in this connection, been tested with regard to their achievement potential. The one-way system further reduces expenditure for cleaning, maintaining and setting-up of the unit. The unit allows the determination of the important parameters influencing the line dispensing of unfilled adhesives with a line width of <50 μm.
Starting Page	1895
Ending Page	1901
Page Count	7
File Format	PDF
ISSN	09467076
Journal	Microsystem Technologies
Volume Number	14
Issue Number	12
e-ISSN	14321858
Language	English
Publisher	Springer-Verlag
Publisher Date	2008-05-10
Publisher Place	Berlin, Heidelberg
Access Restriction	One Nation One Subscription (ONOS)
Subject Keyword	Mechanical Engineering Nanotechnology Electronics and Microelectronics, Instrumentation
Content Type	Text
Resource Type	Article
Subject	Nanoscience and Nanotechnology Condensed Matter Physics Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering Hardware and Architecture

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