NDLI: Development of a brazed diamond wire for slicing single-crystal SiC ingots

Content Provider	Springer Nature Link
Author	He, Zhaobin Huang, Hui Yin, Fang Xu, Xipeng
Copyright Year	2016
Abstract	Fixed abrasive wires, electroplated wire saws, and resinoid wire saws are widely used to slice brittle materials. However, poor wear resistance becomes a crucial issue when these tools are used in hard brittle materials, such as single-crystal silicon carbide (SiC). This problem was addressed in this study through the development of brazed diamond wires. The production method and the slicing performance of brazed diamond wire were systematically investigated. A complete wire manufacturing line was developed to fabricate brazed diamond wire. Effect of brazing temperature on diamond grain graphitization damage was experimentally researched. The results indicated that the diamond grain graphitization damage was weakened or avoided with the optimized brazing temperature and holding time. Effect of brazing temperature on core wire mechanical property was evaluated by tensile strength, breaking twist strength, and repeated bending strength. Long brazed diamond wires were produced with optimized produce parameters for various brazing alloys. Sawing experiments on single-crystal SiC reveal that the slicing ability and slicing efficiency of the self-made brazed wire saws were better than those of commercial electroplated wire saws.
Starting Page	189
Ending Page	199
Page Count	11
File Format	PDF
ISSN	02683768
Journal	The International Journal of Advanced Manufacturing Technology
Volume Number	91
Issue Number	1-4
e-ISSN	14333015
Language	English
Publisher	Springer London
Publisher Date	2016-11-18
Publisher Place	London
Access Restriction	One Nation One Subscription (ONOS)
Subject Keyword	Brazed Diamond Wire Saws, single-crystal SiC Industrial and Production Engineering Media Management Mechanical Engineering Computer-Aided Engineering (CAD, CAE) and Design
Content Type	Text
Resource Type	Article
Subject	Industrial and Manufacturing Engineering Control and Systems Engineering Mechanical Engineering Computer Science Applications Software

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Experimental investigation on the machining characteristics of single-crystal SiC sawing with the fixed diamond wire

Experimental research on KDP crystal slicing with resin bonded diamond abrasive wire saw

Phase and stress evolution of Si swarf in the diamond-coated wire sawing of Si ingots

Phase and stress evolution in diamond microparticles during diamond-coated wire sawing of Si ingots

Comparison on foil EDM characteristics of single crystal SiC between in deionized water and in EDM oil

Grinding of brittle materials with brazed diamond grinding wheel

Failure mechanisms and cutting characteristics of brazed single diamond grains

Experimental research on performance of monolayer brazed diamond wheel through a new precise dressing method—plate wheel dressing

Microstructure and performance of monolayer brazed grinding wheel with polycrystalline diamond grains

Development of a brazed diamond wire for slicing single-crystal SiC ingots

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