NDLI: Phase and stress evolution of Si swarf in the diamond-coated wire sawing of Si ingots

Content Provider	Springer Nature Link
Author	Banerjee, Sriya Yang, Junting Wu, Junnan Heredia, Michelle Gao, Zhengning Myung, Yoon Rezvanian, Omid Banerjee, Parag
Copyright Year	2016
Abstract	Diamond-coated wire (DCW) sawing of Si solar ingots generates swarf which is analyzed using micro-Raman spectroscopy. Two types of Si swarf are found. Particulate swarf is crystalline and shows residual compressive stress. Fibrillar swarf is amorphous and shows residual tensile stress. The origin of particulate, crystalline swarf is attributed to brittle machining, while the origin of fibrillar, amorphous swarf is attributed to ductile machining. Finite element modeling suggests that brittle machining resulting in particulate, crystalline swarf generation is initiated by sharp diamond microparticles. On the other hand, ductile machining resulting in fibrillar, amorphous swarf generation is caused by blunt diamond microparticles. Over the course of sawing, the ratio of crystalline/amorphous phase in swarf decreases, quantifying the average loss in sharpness of diamond microparticles. Thus, micro-Raman spectroscopy can be an effective analytical tool for quantifying and monitoring DCW sawing processes for Si solar ingots.
Starting Page	735
Ending Page	742
Page Count	8
File Format	PDF
ISSN	02683768
Journal	The International Journal of Advanced Manufacturing Technology
Volume Number	89
Issue Number	1-4
e-ISSN	14333015
Language	English
Publisher	Springer London
Publisher Date	2016-07-09
Publisher Place	London
Access Restriction	One Nation One Subscription (ONOS)
Subject Keyword	Swarf Diamond-coated wire sawing Si ingots Industrial and Production Engineering Media Management Mechanical Engineering Computer-Aided Engineering (CAD, CAE) and Design
Content Type	Text
Resource Type	Article
Subject	Industrial and Manufacturing Engineering Control and Systems Engineering Mechanical Engineering Computer Science Applications Software

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