NDLI: Nanomanufacturing of densely packed ultra-fine nanostructures by nano plastic forming and etching (NPFE)

Content Provider	Springer Nature Link
Author	Rashidi, Hassan Yoshi, Masahiko
Copyright Year	2011
Abstract	In this paper, adhesion between a metallic mask and a substrate is studied for further improvement of nano plastic forming and etching (NPFE), a nanofabrication process developed recently by the authors, in terms of the minimum pitch that can be achieved by this process. Control parameters of sputter deposition process, i.e., mask thickness, gas pressure, and ion current were studied for their influence on the adhesion. Silicon wafer was used as the substrate, and gold (Au) was used as the mask. First, the influence of the mask thickness on the adhesion was investigated, and the proper thickness was determined. Then, the influence of gas pressure on the adhesion was investigated, and the optimum gas pressure, in order to achieve the minimum pitch, was determined. Finally, the influence of ion current on the adhesion was investigated, and the optimum ion current was determined. Array of 20-nm-wide trenches with a periodicity of 120 nm were fabricated on silicon wafer using the improved nano plastic forming and etching. This improvement demonstrates the capability of NPFE for fabricating densely packed nanostructures with ultra-fine feature size and extremely high resolution.
Starting Page	605
Ending Page	615
Page Count	11
File Format	PDF
ISSN	02683768
Journal	The International Journal of Advanced Manufacturing Technology
Volume Number	57
Issue Number	5-8
e-ISSN	14333015
Language	English
Publisher	Springer-Verlag
Publisher Date	2011-04-13
Publisher Place	London
Access Restriction	One Nation One Subscription (ONOS)
Subject Keyword	Nanomanufacturing Nano plastic forming Nanostructures Feature size Pitch Adhesion Production/Logistics/Supply Chain Mechanical Engineering Computer-Aided Engineering (CAD, CAE) and Design Industrial and Production Engineering
Content Type	Text
Resource Type	Article
Subject	Industrial and Manufacturing Engineering Control and Systems Engineering Mechanical Engineering Computer Science Applications Software

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