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Low Temperature Co-fired Ceramic (LTCC) Technology for RF Multi-layer Circuit Applications-Technology and Modeling
| Content Provider | Semantic Scholar |
|---|---|
| Author | Fathy, Aly E. |
| Copyright Year | 2005 |
| Abstract | Mixed signal RF wireless products require the development of a low cost multi-layer, multi-chip packaging technology. LTCC has matured in the last few years, and it is optimum for this application. Examples of manufacturing approaches and design libraries are shown here with a few examples to demonstrate its enabling power. |
| File Format | PDF HTM / HTML |
| Alternate Webpage(s) | http://www.ursi.org/proceedings/procGA05/pdf/D03.10(0626).pdf |
| Language | English |
| Access Restriction | Open |
| Content Type | Text |
| Resource Type | Article |