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Mechanisms for interfacial reactions between liquid Sn-3.5Ag solders and cu substrates
| Content Provider | Semantic Scholar |
|---|---|
| Author | Chuang, Tung-Han Cheng, M. D. Chang, Shi-Chung |
| Copyright Year | 2004 |
| Abstract | Intermetallic compounds formed during the soldering reactions between Sn-3.5Ag and Cu at temperatures ranging from 250°C to 375°C are investigated. The results indicate that scallop-shaped η-Cu6(Sn0.933 Ag0.007)5 intermetallics grow from the Sn-3.5Ag/Cu interface toward the solder matrix accompanied by Cu dissolution. Following prolonged or higher temperature reactions, ɛ-Cu3 (Sn0.996 Ag0.004) intermetallic layers appear behind the Cu6(Sn0.933 Ag0.007)5 scallops. The growth of these interfacial intermetallics is governed by a kinetic relation: ΔX=tn, where the n values for η and ɛ intermetallics are 0.75 and 0.96, respectively. The mechanisms for such nonparabolic growth of interfacial intermetallics during the liquid/solid reactions between Sn-3.5Ag solders and Cu substrates are probed. |
| Starting Page | 22 |
| Ending Page | 27 |
| Page Count | 6 |
| File Format | PDF HTM / HTML |
| DOI | 10.1007/s11664-004-0289-1 |
| Alternate Webpage(s) | http://ntur.lib.ntu.edu.tw//bitstream/246246/95944/1/86.pdf |
| Alternate Webpage(s) | https://doi.org/10.1007/s11664-004-0289-1 |
| Volume Number | 33 |
| Language | English |
| Access Restriction | Open |
| Content Type | Text |
| Resource Type | Article |
