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Characterization of Interfacial Reaction Layers Formed Between Sn-3.5Ag Solder and Electroless Ni-Immersion Au-Plated Cu Substrates
| Content Provider | Semantic Scholar |
|---|---|
| Author | Kang, Han-Byul Bae, Jee-Hwan Lee, Jae-Wook Park, Min-Ho Yoon, Jeong-Won Jung, Seung-Boo Yang, Cheol-Woong |
| Copyright Year | 2008 |
| Abstract | The interfacial reaction between a eutectic Sn-3.5wt.%Ag solder and an electroless nickel–immersion gold-plated Cu substrate during reflow was examined by transmission electron microscopy (TEM). During the initial reflowing, the amorphous, electroless Ni (P)-plated layer crystallized into two P-rich Ni layers: a Ni12P5 + Ni3P mixed upper layer and a Ni3P lower layer. No ternary Ni-Sn-P layer was observed in the initial stage. After subsequent reflow for 60 s, a ternary Ni2SnP layer (containing a small amount of the Ni3P phase) was formed between the Ni3Sn4 and P-rich Ni layers (Ni3P + Ni12P5 + Ni). |
| Starting Page | 84 |
| Ending Page | 89 |
| Page Count | 6 |
| File Format | PDF HTM / HTML |
| DOI | 10.1007/s11664-007-0262-x |
| Alternate Webpage(s) | https://page-one.springer.com/pdf/preview/10.1007/s11664-007-0262-x |
| Alternate Webpage(s) | https://doi.org/10.1007/s11664-007-0262-x |
| Volume Number | 37 |
| Language | English |
| Access Restriction | Open |
| Content Type | Text |
| Resource Type | Article |
