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A Novel High Thermal Conductive Underfill for Flip Chip Application
| Content Provider | Semantic Scholar |
|---|---|
| Author | Liu, Mary Ashley Yin, Wusheng |
| Copyright Year | 2013 |
| Abstract | Silicon dioxide is normally used as filler in underfill. The thermal conductivity of underfill is less than 1 w/mk, which is not able to meet the current flip chip application requirements such as 3D stacked multi-chips packaging. No matter which direction the heat will be dissipated through PCB or chip, the heat has to pass through the underfill in 3D stacked chips. Therefore the increase of thermal conductivity of underfill can significantly enhance the reliability of electronic devices, particularly in 3D package devices. YINCAE Advanced Materials, LLC has developed a novel high thermal conductive underfill for flip chip applications. Diamond powder is selected as filler in our product system due to its excellent thermal stability and high thermal conductivity. Three different diamond powders have been used as filler in underfill, the thermal conductivity has been increased many times (up to 6w/mk), which can greatly reduce the thermal stress for solder joint. The flowability, pressure cooking test and... |
| Starting Page | 265 |
| Ending Page | 270 |
| Page Count | 6 |
| File Format | PDF HTM / HTML |
| DOI | 10.4071/isom-2013-TP31 |
| Volume Number | 2013 |
| Alternate Webpage(s) | http://www.yincae.com/assets/anovelhighthermalconductiveunderfillforflipchipapplication(wp1000-32013).pdf |
| Alternate Webpage(s) | https://smtnet.com/library/files/upload/WP112213.pdf |
| Alternate Webpage(s) | http://www.circuitnet.com/news/uploads/2/ANovelHighThermalConductiveUnderfillForFlipChipApplication.pdf |
| Alternate Webpage(s) | https://doi.org/10.4071/isom-2013-TP31 |
| Language | English |
| Access Restriction | Open |
| Content Type | Text |
| Resource Type | Article |
