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Effect of Surface Contamination on Solid-State Bondability of Sn-Ag-Cu Bumps in Ambient Air
| Content Provider | Semantic Scholar |
|---|---|
| Author | Wang, Ying-Hui Suga, Tadatomo |
| Copyright Year | 2008 |
| Abstract | Two solid-state bonding methods, thermocompression bonding (TCB) and surface activated bonding (SAB), were used for studying the effect of surface contamination on the bonding of Sn-Ag-Cu bumps in ambient air. The surface contamination was analyzed by X-ray photoelectron spectroscopy. Correlated to the surface contamination, the influence of Ar-plasma pretreatment time as well as the air exposure time on the shear strength was investigated in SAB process. The bonding of Sn-Ag-Cu bumps was achieved at 25–200C benefiting from dispersing the surface contamination. With an Ar-plasma activation process prior to the assembly under a low-vacuum background, the carbon contaminants on the bump surfaces in SAB process was removed, and the required bonding pressure or temperature to achieve a high shear strength and bond yield is lower than that in TCB process. [doi:10.2320/matertrans.MF200804] |
| Starting Page | 1508 |
| Ending Page | 1512 |
| Page Count | 5 |
| File Format | PDF HTM / HTML |
| DOI | 10.2320/matertrans.mf200804 |
| Volume Number | 49 |
| Alternate Webpage(s) | https://www.jstage.jst.go.jp/article/matertrans/49/7/49_MF200804/_pdf |
| Alternate Webpage(s) | http://www.jim.or.jp/journal/e/pdf3/49/07/1508.pdf |
| Alternate Webpage(s) | https://doi.org/10.2320/matertrans.mf200804 |
| Language | English |
| Access Restriction | Open |
| Content Type | Text |
| Resource Type | Article |
