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Zastosowanie podłoży DBC w praktycznych realizacjach układów elektroniki dużej mocy
| Content Provider | Semantic Scholar |
|---|---|
| Author | Grzesiak, W. Mackow, Piotr Kulawik, Jan Maj, Tomasz Synkiewicz, Beata Witek, Krzysztof |
| Copyright Year | 2015 |
| Abstract | The article presents selected issues of DBC (Direct Bonded Copper) technology for the production of ceramic substrates coated at one or both sides with a thick Cu layers. Properties of DBC substrates and analysis of their areas of application are discussed. The preliminary work carried out in the Krakow Division of the ITE, resulted in the development of technology and design of high power electronics systems based on the DBC technique. Preparation of test samples, allowed to identify the minimum width of the paths, the minimum distance between them, their current capacity, the possibility of achieving thermoand ultrasonic bonding connections and the ability to attach SMD elements, such as resistors, capacitors, transistors, power MOS-FET, LED and selected integrated circuits. In the paper various practical implementations of power electronics circuits are presented. (Application of DBC substrates for practical implementations in power electronics circuits). Słowa kluczowe: podłoża DBC, montaż SMT, układy dużej mocy. |
| Starting Page | 46 |
| Ending Page | 49 |
| Page Count | 4 |
| File Format | PDF HTM / HTML |
| DOI | 10.15199/48.2015.09.13 |
| Alternate Webpage(s) | http://pe.org.pl/articles/2015/9/13.pdf |
| Alternate Webpage(s) | https://doi.org/10.15199/48.2015.09.13 |
| Language | English |
| Access Restriction | Open |
| Content Type | Text |
| Resource Type | Article |
