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PREPREG FOR LAMINATE AND PROCESS FOR PRODUCING PRINTED WIRING-BOARD USING THE SAME BACKGROUND OF THE INVENTION 1. Field of the Invention
| Content Provider | Semantic Scholar |
|---|---|
| Copyright Year | 2017 |
| Abstract | The problems are to provide a prepreg for laminate which can Secure a heat resistance, electrical insulation properties and an adhesion Strength of a conductor layer, a printed wiring-board which Satisfies a high density and which is excellent in a heat resistance and electrical insulation prop erties upon utilizing the conventional production equipment and method of laminate pressing, and a process for produc ing the same. |
| File Format | PDF HTM / HTML |
| Alternate Webpage(s) | https://patentimages.storage.googleapis.com/90/19/12/56cf708402627e/US6124023.pdf |
| Language | English |
| Access Restriction | Open |
| Content Type | Text |
| Resource Type | Article |