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Polymide Substrate and Method of Manufacturing Printed Wiring Board Using the Same Field of the Invention
| Content Provider | Semantic Scholar |
|---|---|
| Author | Cordani, John L. |
| Copyright Year | 2017 |
| Abstract | nventors: Mark Wojtaszek, OCKleClge La., I I W (76) I Mark Woj k, 15 Rockledge L. 6,440,576 B1 ck 8/2002 Yamamoto etal Canton, CT (US) 06019; James 6,541,080 B1 4/2003 Pies . 427,532 . s 6,632,344 B1 10/2003 Goldberg et al. Watkowski, 100 Ravenwood Dr. 2001/0007289 A1* 7/2001 Bhatt et al. . 174,262 Middlebury, CT (US) 06762, Gary B. 2002/0134775 A1* 9, 2002 Ohashi et al. . . 219,444.1 Larson, 1310 Avon Blvd., Cheshire, CT 2004/0018131 A1 1/2004 Izumida et al. . 423, 22 (US) 06410; Peter Kukanskis, 245 2004/0222103 A1* 11/2004 Marsales et al. . . 205,158 Quassapaug Rd., Woodbury, CT (US) 2006/0230611 A1* 10, 2006 Wakisaka . 29,846 |
| File Format | PDF HTM / HTML |
| Alternate Webpage(s) | https://patentimages.storage.googleapis.com/c3/ef/80/1c494fd43785db/US7666471.pdf |
| Alternate Webpage(s) | https://patentimages.storage.googleapis.com/71/f5/87/ef065ae1e5863d/US20070224346A1.pdf |
| Language | English |
| Access Restriction | Open |
| Content Type | Text |
| Resource Type | Article |